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2UUL DA28 FlatCut No.11 Mobile IC Solder Pad Underfill Glue Removal Blade
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2UUL DA28 FlatCut No.11 Mobile IC Solder Pad Underfill Glue Removal Blade

2UUL DA28 FlatCut No.11 Mobile IC Solder Pad Underfill Glue Removal Blade

2UUL DA28 FlatCut Solder Pad Underfill Glue Fast Removal Blades (5pcs/box) and 2UUL DA18 BB Shark #11 Blade No.11 (100pcs/pack) for Mobile Phone PCB CPU IC Glue Cleaning Removal without damaging the motherboard or CPU chip. 2UUL DA18 DA28 Phone Motherboard BGA Chip Repair Knife lightning fast scraper designed for removing residual glue and solder pads on circuit boards and mobile phone CPU PCB, convenient for cleaning.

Option:
1. 2UUL DA28 FlatCut Blade.
2. 2UUL DA18 No.11 Blade.

2UUL DA18 BB Shark No.11 Blade Features:
1. High Edge Deformation Resistance.
2. High-Carbon Steel, Unbreakable.
3. Individual Packaging, Rust-Proof.
4. Tear-Notched, Quick Take.

DA28 FlatCut Blade Parameters:
Name: DA28 FLATCUT-Solder Pad Underfill Glue Fast Removal Blade (5 Pcs/Box)
Product Size: 37x9x0.5mm
Gross Weight: 14.5g
Package Size: 54.5x33x20mm
Net Weight: 5g(5 Pcs)

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From $0.56

Original: $1.59

-65%
2UUL DA28 FlatCut No.11 Mobile IC Solder Pad Underfill Glue Removal Blade—

$1.59

$0.56

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2UUL DA28 FlatCut No.11 Mobile IC Solder Pad Underfill Glue Removal Blade - Image 2
2UUL DA28 FlatCut No.11 Mobile IC Solder Pad Underfill Glue Removal Blade - Image 3
2UUL DA28 FlatCut No.11 Mobile IC Solder Pad Underfill Glue Removal Blade - Image 4
2UUL DA28 FlatCut No.11 Mobile IC Solder Pad Underfill Glue Removal Blade - Image 5
2UUL DA28 FlatCut No.11 Mobile IC Solder Pad Underfill Glue Removal Blade - Image 6
2UUL DA28 FlatCut No.11 Mobile IC Solder Pad Underfill Glue Removal Blade - Image 7

2UUL DA28 FlatCut No.11 Mobile IC Solder Pad Underfill Glue Removal Blade

2UUL DA28 FlatCut Solder Pad Underfill Glue Fast Removal Blades (5pcs/box) and 2UUL DA18 BB Shark #11 Blade No.11 (100pcs/pack) for Mobile Phone PCB CPU IC Glue Cleaning Removal without damaging the motherboard or CPU chip. 2UUL DA18 DA28 Phone Motherboard BGA Chip Repair Knife lightning fast scraper designed for removing residual glue and solder pads on circuit boards and mobile phone CPU PCB, convenient for cleaning.

Option:
1. 2UUL DA28 FlatCut Blade.
2. 2UUL DA18 No.11 Blade.

2UUL DA18 BB Shark No.11 Blade Features:
1. High Edge Deformation Resistance.
2. High-Carbon Steel, Unbreakable.
3. Individual Packaging, Rust-Proof.
4. Tear-Notched, Quick Take.

DA28 FlatCut Blade Parameters:
Name: DA28 FLATCUT-Solder Pad Underfill Glue Fast Removal Blade (5 Pcs/Box)
Product Size: 37x9x0.5mm
Gross Weight: 14.5g
Package Size: 54.5x33x20mm
Net Weight: 5g(5 Pcs)

Product Information

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Description

2UUL DA28 FlatCut Solder Pad Underfill Glue Fast Removal Blades (5pcs/box) and 2UUL DA18 BB Shark #11 Blade No.11 (100pcs/pack) for Mobile Phone PCB CPU IC Glue Cleaning Removal without damaging the motherboard or CPU chip. 2UUL DA18 DA28 Phone Motherboard BGA Chip Repair Knife lightning fast scraper designed for removing residual glue and solder pads on circuit boards and mobile phone CPU PCB, convenient for cleaning.

Option:
1. 2UUL DA28 FlatCut Blade.
2. 2UUL DA18 No.11 Blade.

2UUL DA18 BB Shark No.11 Blade Features:
1. High Edge Deformation Resistance.
2. High-Carbon Steel, Unbreakable.
3. Individual Packaging, Rust-Proof.
4. Tear-Notched, Quick Take.

DA28 FlatCut Blade Parameters:
Name: DA28 FLATCUT-Solder Pad Underfill Glue Fast Removal Blade (5 Pcs/Box)
Product Size: 37x9x0.5mm
Gross Weight: 14.5g
Package Size: 54.5x33x20mm
Net Weight: 5g(5 Pcs)

2UUL DA28 FlatCut No.11 Mobile IC Solder Pad Underfill Glue Removal Blade | CHINA PHONEFIX SHOP Team