2UUL WAHE G101 UV Adhesive Glue for Screen Bonding & CPU IC Fixing
2UUL G101 Wahe Glue UV Adhesive is suitable for fixing CPU chip components on mobile phone PCBs and bonding screens. It requires a UV curing lamp. It's a transparent UV adhesive with strong adhesion, elasticity, and no cracking. Heating it facilitates software disassembly. 2UUL mobile phone repair teams use this G101 Wahe UV Glue to repair mobile phone cameras, screens, motherboards, etc.
Features:
1. Fast Curing: Cures rapidly under UV light, providing a strong bond.
2. Elastic and Crack-Resistant: Maintains good elasticity after curing, preventing cracking and ensuring long-term stability.
3. Easy Disassembly: Softens under heating, facilitating disassembly.
4. High Bond Strength: High bond strength ensures stable component fixation.
5. High Temperature Resistance: Adaptable to operating environments from -40°C to 100°C, suitable for various devices and environments.
6. Compatible with Various Substrates: Bonds well to PC, metal, and other substrates.
Product Nature:
Viscosity: 600~800 mPa.s
Hardness: 78D
Volume Resistance: 8.3 × 10¹² (Ω), (GB/T1040.2-2006)
Expansion Coefficient:
106.1 μm/(m·°C)（-30°C ~ 10°C）
207.2 μm/(m·°C)（30°C ~ 100°C）
(ASTM E831-19)
Operating Temperature: -40°C ~ 100°C
Substrate: PC / METAL
Test Conditions: 65°C 90% RH (72h)
Bond Strength Retention Rate: 90%
CAPACITY: 20 ml
Product Specifications：
Name: WAHE GLUE UV Adhesive Series
Model: G101
Net Weight: 25g
Gross Weight: 30g
Product Dimensions: 22x16x113mm
Packaging Dimensions: 24x24x117mm
Original: $3.69
-65%$3.69
$1.29More Images
2UUL WAHE G101 UV Adhesive Glue for Screen Bonding & CPU IC Fixing
2UUL G101 Wahe Glue UV Adhesive is suitable for fixing CPU chip components on mobile phone PCBs and bonding screens. It requires a UV curing lamp. It's a transparent UV adhesive with strong adhesion, elasticity, and no cracking. Heating it facilitates software disassembly. 2UUL mobile phone repair teams use this G101 Wahe UV Glue to repair mobile phone cameras, screens, motherboards, etc.
Features:
1. Fast Curing: Cures rapidly under UV light, providing a strong bond.
2. Elastic and Crack-Resistant: Maintains good elasticity after curing, preventing cracking and ensuring long-term stability.
3. Easy Disassembly: Softens under heating, facilitating disassembly.
4. High Bond Strength: High bond strength ensures stable component fixation.
5. High Temperature Resistance: Adaptable to operating environments from -40°C to 100°C, suitable for various devices and environments.
6. Compatible with Various Substrates: Bonds well to PC, metal, and other substrates.
Product Nature:
Viscosity: 600~800 mPa.s
Hardness: 78D
Volume Resistance: 8.3 × 10¹² (Ω), (GB/T1040.2-2006)
Expansion Coefficient:
106.1 μm/(m·°C)（-30°C ~ 10°C）
207.2 μm/(m·°C)（30°C ~ 100°C）
(ASTM E831-19)
Operating Temperature: -40°C ~ 100°C
Substrate: PC / METAL
Test Conditions: 65°C 90% RH (72h)
Bond Strength Retention Rate: 90%
CAPACITY: 20 ml
Product Specifications：
Name: WAHE GLUE UV Adhesive Series
Model: G101
Net Weight: 25g
Gross Weight: 30g
Product Dimensions: 22x16x113mm
Packaging Dimensions: 24x24x117mm
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
2UUL G101 Wahe Glue UV Adhesive is suitable for fixing CPU chip components on mobile phone PCBs and bonding screens. It requires a UV curing lamp. It's a transparent UV adhesive with strong adhesion, elasticity, and no cracking. Heating it facilitates software disassembly. 2UUL mobile phone repair teams use this G101 Wahe UV Glue to repair mobile phone cameras, screens, motherboards, etc.
Features:
1. Fast Curing: Cures rapidly under UV light, providing a strong bond.
2. Elastic and Crack-Resistant: Maintains good elasticity after curing, preventing cracking and ensuring long-term stability.
3. Easy Disassembly: Softens under heating, facilitating disassembly.
4. High Bond Strength: High bond strength ensures stable component fixation.
5. High Temperature Resistance: Adaptable to operating environments from -40°C to 100°C, suitable for various devices and environments.
6. Compatible with Various Substrates: Bonds well to PC, metal, and other substrates.
Product Nature:
Viscosity: 600~800 mPa.s
Hardness: 78D
Volume Resistance: 8.3 × 10¹² (Ω), (GB/T1040.2-2006)
Expansion Coefficient:
106.1 μm/(m·°C)（-30°C ~ 10°C）
207.2 μm/(m·°C)（30°C ~ 100°C）
(ASTM E831-19)
Operating Temperature: -40°C ~ 100°C
Substrate: PC / METAL
Test Conditions: 65°C 90% RH (72h)
Bond Strength Retention Rate: 90%
CAPACITY: 20 ml
Product Specifications：
Name: WAHE GLUE UV Adhesive Series
Model: G101
Net Weight: 25g
Gross Weight: 30g
Product Dimensions: 22x16x113mm
Packaging Dimensions: 24x24x117mm
