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AMAOE IP NAND Flash Reballing Stencil HDD Positioning Steel Mesh
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AMAOE IP NAND Flash Reballing Stencil HDD Positioning Steel Mesh

AMAOE IP NAND Flash Reballing Stencil HDD Positioning Steel Mesh

AMAOE IP Nand Stencil Apple Memory Chip Positioning steel mesh for iPhone NAND flash positioning auxiliary tinning repair. Amoe BGA315/BGA110 Nand Memory Chip Conversion Steel Mesh. AMAOE U-APHD1 AP NAND BGA reballing stencil for BGA315 BGA110 BGA70 BGA60. AMAOE Apple PCIE NAND 0.25mm reballing steel mesh for iPhone X/11/12/13/14/15/16.

Option:
1. AMAOE IP NAND positioning stencil: 14.6*11.8mm 13.3*11mm 13.3*9mm 3 in 1 set.
2. AMAOE U-APHD1 0.15mm reballing stencil: AP NAND stencil for BAG70 BGA315 BGA110 BGA60 BGA52.
3. AMAOE Apple PCIE/NAND 0.25mm reballing stencil.
4. AMAOE BGA315/BGA110 Nand Flash conversion stencil.

Select Option
From $0.56

Original: $1.59

-65%
AMAOE IP NAND Flash Reballing Stencil HDD Positioning Steel Mesh—

$1.59

$0.56

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AMAOE IP NAND Flash Reballing Stencil HDD Positioning Steel Mesh - Image 4
AMAOE IP NAND Flash Reballing Stencil HDD Positioning Steel Mesh - Image 5

AMAOE IP NAND Flash Reballing Stencil HDD Positioning Steel Mesh

AMAOE IP Nand Stencil Apple Memory Chip Positioning steel mesh for iPhone NAND flash positioning auxiliary tinning repair. Amoe BGA315/BGA110 Nand Memory Chip Conversion Steel Mesh. AMAOE U-APHD1 AP NAND BGA reballing stencil for BGA315 BGA110 BGA70 BGA60. AMAOE Apple PCIE NAND 0.25mm reballing steel mesh for iPhone X/11/12/13/14/15/16.

Option:
1. AMAOE IP NAND positioning stencil: 14.6*11.8mm 13.3*11mm 13.3*9mm 3 in 1 set.
2. AMAOE U-APHD1 0.15mm reballing stencil: AP NAND stencil for BAG70 BGA315 BGA110 BGA60 BGA52.
3. AMAOE Apple PCIE/NAND 0.25mm reballing stencil.
4. AMAOE BGA315/BGA110 Nand Flash conversion stencil.

Product Information

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Description

AMAOE IP Nand Stencil Apple Memory Chip Positioning steel mesh for iPhone NAND flash positioning auxiliary tinning repair. Amoe BGA315/BGA110 Nand Memory Chip Conversion Steel Mesh. AMAOE U-APHD1 AP NAND BGA reballing stencil for BGA315 BGA110 BGA70 BGA60. AMAOE Apple PCIE NAND 0.25mm reballing steel mesh for iPhone X/11/12/13/14/15/16.

Option:
1. AMAOE IP NAND positioning stencil: 14.6*11.8mm 13.3*11mm 13.3*9mm 3 in 1 set.
2. AMAOE U-APHD1 0.15mm reballing stencil: AP NAND stencil for BAG70 BGA315 BGA110 BGA60 BGA52.
3. AMAOE Apple PCIE/NAND 0.25mm reballing stencil.
4. AMAOE BGA315/BGA110 Nand Flash conversion stencil.