AMTECH NC-559-ASM Lead-Free Solder Flux Paste for BGA Welding Repair

AMTECH NC-559-ASM 10cc/30cc no-clean solder paste for cell phone PCB BGA soldering repair tools. Original NC-559-ASM lead-free solder paste flux for mobile phone BGA reballing, lead free solder paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.

Note: solder paste can only can be sent out by special mail post.

Description:
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.

Features:

1. Excellent capacity of solder-stickiness
2. Excellent Anti-wet Capacity
3. Widely used on BGA, PGA, CSP packages and flip chip operation
4. Suitable for multiple PCB reflow
5. No-clean and Lead free for environmental protection

Specification:

• Brand: AMTECH
• Flux Type: NC-559-ASM
• Volume: 10cc/30cc / bottle
• Color: Yellow
• Weight: 0.08kg

Package includes:

• 1pc x NC-559-ASM Solder Flux Solder Paste