CPU Nand Glue Remover Epoxy BGA IC Chip Adhesive Cleaner

Lanrui 250ml CPU Nand WiFi Chip Glue Remover Liquid Cleaner BGA IC Adhesive Remove Liquid Adhesive Epoxy Remover, High effect BGA IC Adhesive Glue Removing Epoxy Remover Cell Phone BGA-IC Repair Remove Liquid Phone Repair Tool 250ml.

Please note: Now there are no shipping methods that can ship liquids packaged in metal cans overseas. Liquids in plastic bottles can be shipped out through special ways (Economy shipping). If you are not shipping to mainland China, please choose the plastic bottle version.

Features:
Lanrui 250ml BGA IC glue epoxy remover. 
Soften & remove resinating and sealing glue of chip BGA IC of mobile phones easily.
Quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.
It won't do harm to your circuit board and components.
Environment friendly and safe.

Package included:
1 x CPU Glue Remover