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i2C P30S PCB Heating Desoldering Platform for iPhone X-16 Pro Max
i2C P30S preheating desoldering platform for iPhone X/11/12/13/14/15/16 Pro Max motherboard layering repair and glue removal. i2C P30S power supply with desoldering table and iPhone heating plate for iPhone X-16 Pro Max repair.
Option:
1. i2C P30/P30S motherboard heating platform + universal module (1 module).
4. i2C P30/P30S motherboard heating platform + iPhone X-16 Pro Max heating module (6 modules).
2. i2C P30/P30S motherboard heating platform + iPhone X-15 Pro Max heating module (5 modules).
3. i2C P30/P30S motherboard heating platform + iPhone X-16 Pro Max heating module + glue removal module + universal module (8 modules).
4. Optional modules.
Note: All expansion modules must be used with the P30/P30S power supply.
Option:
1. i2C P30/P30S motherboard heating platform + universal module (1 module).
4. i2C P30/P30S motherboard heating platform + iPhone X-16 Pro Max heating module (6 modules).
2. i2C P30/P30S motherboard heating platform + iPhone X-15 Pro Max heating module (5 modules).
3. i2C P30/P30S motherboard heating platform + iPhone X-16 Pro Max heating module + glue removal module + universal module (8 modules).
4. Optional modules.
Note: All expansion modules must be used with the P30/P30S power supply.
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From $2.45
Original: $6.99
-65%i2C P30S PCB Heating Desoldering Platform for iPhone X-16 Pro Max—
$6.99
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i2C P30S PCB Heating Desoldering Platform for iPhone X-16 Pro Max
i2C P30S preheating desoldering platform for iPhone X/11/12/13/14/15/16 Pro Max motherboard layering repair and glue removal. i2C P30S power supply with desoldering table and iPhone heating plate for iPhone X-16 Pro Max repair.
Option:
1. i2C P30/P30S motherboard heating platform + universal module (1 module).
4. i2C P30/P30S motherboard heating platform + iPhone X-16 Pro Max heating module (6 modules).
2. i2C P30/P30S motherboard heating platform + iPhone X-15 Pro Max heating module (5 modules).
3. i2C P30/P30S motherboard heating platform + iPhone X-16 Pro Max heating module + glue removal module + universal module (8 modules).
4. Optional modules.
Note: All expansion modules must be used with the P30/P30S power supply.
Option:
1. i2C P30/P30S motherboard heating platform + universal module (1 module).
4. i2C P30/P30S motherboard heating platform + iPhone X-16 Pro Max heating module (6 modules).
2. i2C P30/P30S motherboard heating platform + iPhone X-15 Pro Max heating module (5 modules).
3. i2C P30/P30S motherboard heating platform + iPhone X-16 Pro Max heating module + glue removal module + universal module (8 modules).
4. Optional modules.
Note: All expansion modules must be used with the P30/P30S power supply.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
i2C P30S preheating desoldering platform for iPhone X/11/12/13/14/15/16 Pro Max motherboard layering repair and glue removal. i2C P30S power supply with desoldering table and iPhone heating plate for iPhone X-16 Pro Max repair.
Option:
1. i2C P30/P30S motherboard heating platform + universal module (1 module).
4. i2C P30/P30S motherboard heating platform + iPhone X-16 Pro Max heating module (6 modules).
2. i2C P30/P30S motherboard heating platform + iPhone X-15 Pro Max heating module (5 modules).
3. i2C P30/P30S motherboard heating platform + iPhone X-16 Pro Max heating module + glue removal module + universal module (8 modules).
4. Optional modules.
Note: All expansion modules must be used with the P30/P30S power supply.
Option:
1. i2C P30/P30S motherboard heating platform + universal module (1 module).
4. i2C P30/P30S motherboard heating platform + iPhone X-16 Pro Max heating module (6 modules).
2. i2C P30/P30S motherboard heating platform + iPhone X-15 Pro Max heating module (5 modules).
3. i2C P30/P30S motherboard heating platform + iPhone X-16 Pro Max heating module + glue removal module + universal module (8 modules).
4. Optional modules.
Note: All expansion modules must be used with the P30/P30S power supply.
