I2C T18 Motherboard Layered Desoldering Station For iPhone X-16 Pro Max
i2C T18 PCB motherboard layered desoldering station with HD screen display for iPhone X-16 Pro Max. i2C T18 PCB desoldering station supports iPhone X/11/12/13/14/15/16 Pro Max motherboard separation/Chip CPU glue removal degumming/lamination/delamination/desoldering and soldering repair.
Package Option:
Package A: i2C T18 host + Universal module.
Package B: i2C T18 host + Glue removal module.
Package C: i2C T18 host + X-15 series (4pcs modules).
Package D: i2C T18 host + Universal module + Glue removal module + X-15 series (6pcs modules).
Package E: i2C T18 host + Universal module + X-16 series (5pcs modules).
Features:
1. T18 PCB motherboard desoldering station, magnetic modular design, constant temperature desoldering, and explosion-tin proof.
2. LCD HD screen display, 2Gears of temp adjustment, Supports iPhone X to 15Pro Max motherboard separation, chip CPU glue removal, and other functions.
3. Aviation aluminum material, CNC precision processing, high-temperature resistance, and oxidation resistance.
4. Rapid heating, matched with PTC ceramic heating pieces, it can heat up to 180°C in 60 seconds rapidly.
5. Module strong magnetic automatic adsorption, module replacement as you wish, simple and more convenient.
6. Put the chip on and switch to 245℃, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98%of the chips and can meet the needs of 98%of IC glue removal and desoldering on the market.
7. Only one host can support multiple modules, support Apple and Android double-layer motherboard layering, fit, and repair, and can also be applied to the repair of various precision electronic and digital products.
Specification:
Brand: i2C.
Model: T18.
Name: T18 PCB motherboard desoldering station.
Supply voltage: AC 110V~220V.
Minimum temperature: 180°C.
Display: LED digital display.
Maximum temperature: 245℃.
Body size: 134*116*17mm.
Scope of use: Motherboard separation and bonding.
Packing size: 214*143*80mm.
Original: $4.09
-65%$4.09
$1.43More Images
I2C T18 Motherboard Layered Desoldering Station For iPhone X-16 Pro Max
i2C T18 PCB motherboard layered desoldering station with HD screen display for iPhone X-16 Pro Max. i2C T18 PCB desoldering station supports iPhone X/11/12/13/14/15/16 Pro Max motherboard separation/Chip CPU glue removal degumming/lamination/delamination/desoldering and soldering repair.
Package Option:
Package A: i2C T18 host + Universal module.
Package B: i2C T18 host + Glue removal module.
Package C: i2C T18 host + X-15 series (4pcs modules).
Package D: i2C T18 host + Universal module + Glue removal module + X-15 series (6pcs modules).
Package E: i2C T18 host + Universal module + X-16 series (5pcs modules).
Features:
1. T18 PCB motherboard desoldering station, magnetic modular design, constant temperature desoldering, and explosion-tin proof.
2. LCD HD screen display, 2Gears of temp adjustment, Supports iPhone X to 15Pro Max motherboard separation, chip CPU glue removal, and other functions.
3. Aviation aluminum material, CNC precision processing, high-temperature resistance, and oxidation resistance.
4. Rapid heating, matched with PTC ceramic heating pieces, it can heat up to 180°C in 60 seconds rapidly.
5. Module strong magnetic automatic adsorption, module replacement as you wish, simple and more convenient.
6. Put the chip on and switch to 245℃, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98%of the chips and can meet the needs of 98%of IC glue removal and desoldering on the market.
7. Only one host can support multiple modules, support Apple and Android double-layer motherboard layering, fit, and repair, and can also be applied to the repair of various precision electronic and digital products.
Specification:
Brand: i2C.
Model: T18.
Name: T18 PCB motherboard desoldering station.
Supply voltage: AC 110V~220V.
Minimum temperature: 180°C.
Display: LED digital display.
Maximum temperature: 245℃.
Body size: 134*116*17mm.
Scope of use: Motherboard separation and bonding.
Packing size: 214*143*80mm.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
i2C T18 PCB motherboard layered desoldering station with HD screen display for iPhone X-16 Pro Max. i2C T18 PCB desoldering station supports iPhone X/11/12/13/14/15/16 Pro Max motherboard separation/Chip CPU glue removal degumming/lamination/delamination/desoldering and soldering repair.
Package Option:
Package A: i2C T18 host + Universal module.
Package B: i2C T18 host + Glue removal module.
Package C: i2C T18 host + X-15 series (4pcs modules).
Package D: i2C T18 host + Universal module + Glue removal module + X-15 series (6pcs modules).
Package E: i2C T18 host + Universal module + X-16 series (5pcs modules).
Features:
1. T18 PCB motherboard desoldering station, magnetic modular design, constant temperature desoldering, and explosion-tin proof.
2. LCD HD screen display, 2Gears of temp adjustment, Supports iPhone X to 15Pro Max motherboard separation, chip CPU glue removal, and other functions.
3. Aviation aluminum material, CNC precision processing, high-temperature resistance, and oxidation resistance.
4. Rapid heating, matched with PTC ceramic heating pieces, it can heat up to 180°C in 60 seconds rapidly.
5. Module strong magnetic automatic adsorption, module replacement as you wish, simple and more convenient.
6. Put the chip on and switch to 245℃, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98%of the chips and can meet the needs of 98%of IC glue removal and desoldering on the market.
7. Only one host can support multiple modules, support Apple and Android double-layer motherboard layering, fit, and repair, and can also be applied to the repair of various precision electronic and digital products.
Specification:
Brand: i2C.
Model: T18.
Name: T18 PCB motherboard desoldering station.
Supply voltage: AC 110V~220V.
Minimum temperature: 180°C.
Display: LED digital display.
Maximum temperature: 245℃.
Body size: 134*116*17mm.
Scope of use: Motherboard separation and bonding.
Packing size: 214*143*80mm.
