IC Chip Thin Blade BGA Glue Remove Knife For iPhone CPU Disassemble
5Â in 1 IC Chip Repair Thin Blade CPU NAND Remover BGA Maintenance Knife Remove Glue Disassemble Phone PC Rework Processor Tools.
Features:
1. Professional repair tool set for iPhone CPU disassemble.
2. For BGA repair,dismantling phone CPU chip and phone repair.
3. It can be used to separate the welding spot.
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IC Chip Thin Blade BGA Glue Remove Knife For iPhone CPU Disassemble
5Â in 1 IC Chip Repair Thin Blade CPU NAND Remover BGA Maintenance Knife Remove Glue Disassemble Phone PC Rework Processor Tools.
Features:
1. Professional repair tool set for iPhone CPU disassemble.
2. For BGA repair,dismantling phone CPU chip and phone repair.
3. It can be used to separate the welding spot.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
5Â in 1 IC Chip Repair Thin Blade CPU NAND Remover BGA Maintenance Knife Remove Glue Disassemble Phone PC Rework Processor Tools.
Features:
1. Professional repair tool set for iPhone CPU disassemble.
2. For BGA repair,dismantling phone CPU chip and phone repair.
3. It can be used to separate the welding spot.
