iFixes Solder Paste 138℃ 158℃ 183℃ 217℃ PCB BGA Chip Flux

iFixes solder paste is138 is158 is183 is217 conductive silver paste for mobile phone chip repair. iFixes high-density flux for iPhone iPad Phone PCB BGA soldering, desoldering and repair. iFixes 50g 138℃ 158℃ 183℃ 217℃ low/medium/high temperature silver-containing anti-resistance tin paste flux is specially used for mobile phone chip repair.

Features:
1. New silver formula, higher specifications, to solve the pain points of mobile phone maintenance.
2. iFixes contains silver anti-resistance tin paste, professional for mobile phone chip tinning, four temperatures optional.
3. High resistance, high density, strong soldering ability.
4. Bright solder joints, strong soldering force.
5. Not easy to dry, less tinning, high yield rate.

iFixes 138/158/217℃ Solder Paste Parameter:
Brand: iFixes is138 is158 is217.
Melting Point: 138℃/158℃/217℃.
Storage: 0-10°C.
Weight: 50g.
Microns: 25-45um (Sn42 Bi58).

iFixes 183℃ Solder Paste Parameter:
Brand: iFixes is183.
Melting Point: 183°C.
Storage: 0-10°C.
Weight: 50g.
Microns: 20-38um (Sn63 Pb377).