JCID UF6008 Adhesive for Mobile Phone PCB Chip Underfill Repair
JCID UF6008 Chip Underfill is a highly reliable and efficient solution for Nand CPU packaging. With its exceptional features, including rapid and even diffusion, automatic curing, softening under high temperatures. And superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device. Make your maintenance work more professional and reliable.
Features:
1. The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes.
2. Cure within1min/under 150°C or within 5 min/under 100°C automatically.
3. Being softened under high temperature, simplify the process of rework.
4. Superior adhesiveness, improve the anti-dropping resistance, rework is
reduced, prolong the service life of the device.
5. Storage conditions: keep stored in cool places at room temperature.
Specifications:
Product Name: Chip Underfill
Model: UF6008
Brand: JCID
Storage Conditions: keep stored in cool places at room temperature
Made for: Nand CPU packaging
More Images
JCID UF6008 Adhesive for Mobile Phone PCB Chip Underfill Repair
JCID UF6008 Chip Underfill is a highly reliable and efficient solution for Nand CPU packaging. With its exceptional features, including rapid and even diffusion, automatic curing, softening under high temperatures. And superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device. Make your maintenance work more professional and reliable.
Features:
1. The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes.
2. Cure within1min/under 150°C or within 5 min/under 100°C automatically.
3. Being softened under high temperature, simplify the process of rework.
4. Superior adhesiveness, improve the anti-dropping resistance, rework is
reduced, prolong the service life of the device.
5. Storage conditions: keep stored in cool places at room temperature.
Specifications:
Product Name: Chip Underfill
Model: UF6008
Brand: JCID
Storage Conditions: keep stored in cool places at room temperature
Made for: Nand CPU packaging
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
JCID UF6008 Chip Underfill is a highly reliable and efficient solution for Nand CPU packaging. With its exceptional features, including rapid and even diffusion, automatic curing, softening under high temperatures. And superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device. Make your maintenance work more professional and reliable.
Features:
1. The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes.
2. Cure within1min/under 150°C or within 5 min/under 100°C automatically.
3. Being softened under high temperature, simplify the process of rework.
4. Superior adhesiveness, improve the anti-dropping resistance, rework is
reduced, prolong the service life of the device.
5. Storage conditions: keep stored in cool places at room temperature.
Specifications:
Product Name: Chip Underfill
Model: UF6008
Brand: JCID
Storage Conditions: keep stored in cool places at room temperature
Made for: Nand CPU packaging
