Mechanic 10cc Syringe Tin Soldering Paste Flux For PCB BGA Repair

MECHANIC simple syringe-shape solder paste soldering cream for cell phone welding repair, Mechanic paste flux 10CC tin soldering Sn63/Pb37 with syringe and 3 needles for mobile phone SMT PCB repair, Mechanic soldering tin paste flux, Solder joint full, lead-free, environmental protection, strong adhesion.

Melting point : 138℃/148℃/158℃/183℃/217℃

Product Features :

• High-quality performance : Good viscosity, uniform coating, good conductivity, oxidation resistance, no corrosion to PCB, no cleaning
• Bright and full solder joints : Excellent wettability, fine and smooth paste, to ensure that there is no false welding and false soldering, and the solder joints are bright and full with less residue
• Convenient packaging design : Simple syringe-type packing, equipped with a suitable needle tube, to ensure simple and convenient use, and no waste of welding, which can save repair cost
• Function : Phone repair, manual patch, BGA chip tin planting, resistor-capacitor, LED patch, PCB BGA tin plating
• Wide range of products : Mainly used for welding sensors, wires, motors, fuses, connectors, metal shells, lighting, electronic components, SMT maintenance, BGA chip ball planting, ect. of electronic components such as PCB surface resistance, capacitors and IC in the SMT industry.

Steps for usage :

1. Turn counterclockwise to open the cap.
2. Rotate clockwise and install the needle.
3. Open the bottom cover.
4. Install the putter then you can use it.

Note :

1. The white inner plug in the syringe cannot be removed.
2. The putter presented is just to facilitate the push of tin paste, not a supporting tool, it may be loose or tight, please place an order carefully if you mind.

Product Specification :

NS38 :

• Product name: Lead-free low temperature solder paste
• Product Composition: S N42BI58
• Product melting point: 138°C
• Microns: 4#
• Net Weight: 31.6g
• Gross Weight: 40g
• Product Size: 110mm*18mm
• Storage temperature: 0-10℃
• Scope of application: Paper board or other special welding that cannot withstand high temperature
• Features: Full of solder joints, lead-free environmental protection, strong adhesion

NS48 :

• Product name: Unique solder paste for medium and low temperature
• Product model: NS48
• Product melting point: 148℃
• Microns: 4#
• Product net weight: 31.6g
• Product gross weight: 40g
• Product specifications: 110mm*18mm
• Scope of application: Suitable for CPU redo, Apple middle layer fit
• Features: Full solder joints, strong adhesion, less residue
• Storage temperature: 0-10℃

NS58 :

• Product name: Unique solder paste for chips
• Product model: NS58
• Product melting point: 158℃
• Microns: 4#
• Product net weight: 31.6g
• Product gross weight: 40g
• Product specifications: 110mm*18mm
• Scope of application: Suitable for special solder paste for unique chips
• Features: Full solder joints, strong adhesion, less residue
• Storage temperature: 0-10℃

NS83 :

• Product name: Leaded medium temperature solder paste
• Product model: NS83
• Product composition: SN63/PB37
• Product melting point: 183℃
• Microns: 4#
• Product net weight: 31.6g
• Product gross weight: 40g
• Product specifications: 110mm*18mm
• Scope of application: Suitable for basic PCB component maintenance
• Features: Excellent welding performance, no corrosion, less residue
• Storage temperature: 0-10℃

NS17 :

• Product name: Lead-free high temperature solder paste
• Product model: NS17
• Product composition: SN96.5AG 3CU0.5
• Product melting point: 217°C
• Microns: 4#
• Product net weight: 31.6g
• Product gross weight: 40g
• Product specifications: 110mm*18mm
• Scope of application: Suitable for motherboard components that are easier to desolder or heat up
• Features: Full solder joints, strong adhesion, less residue
• Storage temperature: 0-10℃

Package List :

• 1pcs x Mechanic Solder Paste
• 1pcs x Send Putter
• 3pcs x needles