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Mechanic Rosin-Based Tin Flux Paste Cream for Phone PCB Welding Repair
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Mechanic Rosin-Based Tin Flux Paste Cream for Phone PCB Welding Repair

Mechanic Rosin-Based Tin Flux Paste Cream for Phone PCB Welding Repair

MECHANIC High Synthetic BGA Solder Flux Paste Advanced Soldering Paste Flux BGA Soldering Tin Cream for Mobile Phone Motherboard PCB, BGA, SMD Repair.

Option Model:
  • Option 1: Mechanic UV50 flux paste 40G.
  • Option 2: Mechanic UV80 flux paste 60G.
Features:
  1. High bond strength. PH value neutral, insulation is strong, welding surface smooth
  2. IC and PCB for no corrosive
  3. Its boiling point only slightly higher than the melting point of the solder
  4. For mobile phones, PC cards, BGA, SMD, PGA and other sophisticated electronic chip-level help welding

Specifications:
  • Brand: MECHANIC
  • Item name: Soldering paste flux
  • Model: UV50 / UV80
  • Color: Yellow
  • Viscosity: 0.2PaS
  • Granularity: 0.22um
  • Packing: Aluminum box
  • Appliance: PCB, BGA, SMD, PGA repair repair

Instructions:
  1. Wipe the surface of the object before soldering.
  2. Apply the paste flux to the solder joint.
  3. Solder the tin to the solder joint with soldering iron.

Package includes:
  • 1pc x MECHANIC Soldering Paste Flux
Select Option
From $0.54

Original: $1.55

-65%
Mechanic Rosin-Based Tin Flux Paste Cream for Phone PCB Welding Repair—

$1.55

$0.54

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Mechanic Rosin-Based Tin Flux Paste Cream for Phone PCB Welding Repair

MECHANIC High Synthetic BGA Solder Flux Paste Advanced Soldering Paste Flux BGA Soldering Tin Cream for Mobile Phone Motherboard PCB, BGA, SMD Repair.

Option Model:
  • Option 1: Mechanic UV50 flux paste 40G.
  • Option 2: Mechanic UV80 flux paste 60G.
Features:
  1. High bond strength. PH value neutral, insulation is strong, welding surface smooth
  2. IC and PCB for no corrosive
  3. Its boiling point only slightly higher than the melting point of the solder
  4. For mobile phones, PC cards, BGA, SMD, PGA and other sophisticated electronic chip-level help welding

Specifications:
  • Brand: MECHANIC
  • Item name: Soldering paste flux
  • Model: UV50 / UV80
  • Color: Yellow
  • Viscosity: 0.2PaS
  • Granularity: 0.22um
  • Packing: Aluminum box
  • Appliance: PCB, BGA, SMD, PGA repair repair

Instructions:
  1. Wipe the surface of the object before soldering.
  2. Apply the paste flux to the solder joint.
  3. Solder the tin to the solder joint with soldering iron.

Package includes:
  • 1pc x MECHANIC Soldering Paste Flux

Product Information

Shipping & Returns

Description

MECHANIC High Synthetic BGA Solder Flux Paste Advanced Soldering Paste Flux BGA Soldering Tin Cream for Mobile Phone Motherboard PCB, BGA, SMD Repair.

Option Model:
  • Option 1: Mechanic UV50 flux paste 40G.
  • Option 2: Mechanic UV80 flux paste 60G.
Features:
  1. High bond strength. PH value neutral, insulation is strong, welding surface smooth
  2. IC and PCB for no corrosive
  3. Its boiling point only slightly higher than the melting point of the solder
  4. For mobile phones, PC cards, BGA, SMD, PGA and other sophisticated electronic chip-level help welding

Specifications:
  • Brand: MECHANIC
  • Item name: Soldering paste flux
  • Model: UV50 / UV80
  • Color: Yellow
  • Viscosity: 0.2PaS
  • Granularity: 0.22um
  • Packing: Aluminum box
  • Appliance: PCB, BGA, SMD, PGA repair repair

Instructions:
  1. Wipe the surface of the object before soldering.
  2. Apply the paste flux to the solder joint.
  3. Solder the tin to the solder joint with soldering iron.

Package includes:
  • 1pc x MECHANIC Soldering Paste Flux
Mechanic Rosin-Based Tin Flux Paste Cream for Phone PCB Welding Repair | CHINA PHONEFIX SHOP Team