MECHANIC XZ10 Lead Free Soldering Tin Balls Solder Particle

MECHANIC Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools. Leaded Tin Solder Balls for BGA Reballing Soldering Balls Particle Accessories

MECHANIC solder ball 10000PCS/Bottle 

Notice: XZ10 is Lead solder ball, XZW10 is Lead-free Solder ball.

The BGA solder ball has the following characteristics:

• Meet EU ROHS and REACH standards.
• With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance.
• Purity and sphericity are very high, no surface defects.
• Suitable for BGA, CSP and other cutting-edge packaging technology and the use of micro-welding.
• The minimum diameter of the solder ball 0.20mm, non-standard sizes can be customized according to customer requirements.
• When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.