MECHANIC XZ25/XZW25 BGA Solder Balls Motherboard Repair Tool
MECHANIC Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools
MECHANIC solder ball 25000PCS/BottleĀ Ā Ā
Notice: XZ25 is Lead solder ball, XZW25 is Lead-free Solder ball.
The BGA solder ball has the following characteristics:
- Meet EU ROHS and REACH standards.Ā Ā
- With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance.
- Purity and sphericity are very high, no surface defects.
- Suitable for BGA, CSP and other cutting-edge packaging technology and the use of micro-welding.
- The minimum diameter of the solder ball 0.20mm, non-standard sizes can be customized according to customer requirements.
- When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.Ā Ā
Original: $12.90
-65%$12.90
$4.51More Images
MECHANIC XZ25/XZW25 BGA Solder Balls Motherboard Repair Tool
MECHANIC Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools
MECHANIC solder ball 25000PCS/BottleĀ Ā Ā
Notice: XZ25 is Lead solder ball, XZW25 is Lead-free Solder ball.
The BGA solder ball has the following characteristics:
- Meet EU ROHS and REACH standards.Ā Ā
- With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance.
- Purity and sphericity are very high, no surface defects.
- Suitable for BGA, CSP and other cutting-edge packaging technology and the use of micro-welding.
- The minimum diameter of the solder ball 0.20mm, non-standard sizes can be customized according to customer requirements.
- When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.Ā Ā
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Description
MECHANIC Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools
MECHANIC solder ball 25000PCS/BottleĀ Ā Ā
Notice: XZ25 is Lead solder ball, XZW25 is Lead-free Solder ball.
The BGA solder ball has the following characteristics:
- Meet EU ROHS and REACH standards.Ā Ā
- With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance.
- Purity and sphericity are very high, no surface defects.
- Suitable for BGA, CSP and other cutting-edge packaging technology and the use of micro-welding.
- The minimum diameter of the solder ball 0.20mm, non-standard sizes can be customized according to customer requirements.
- When using the automatic calibration with the ability and allow the placement of a relatively large error, unprovoked surface flatness problems.Ā Ā
