MiJing 138A 158A 190A 217A Lead-free Solder Tin Paste
MiJing lead-free tin paste 138A 158A 217A 190A low/medium/high temperature solder flux paste for mobile phone motherboard CPU IC BGA SMD chips soldering repair.
Option:
MJ-138A: Lead free and halogen-free, low temperature tin paste 138 degrees 35 grams.
MJ-158A: Lead free and halogen-free, medium temperature tin slurry 158 degrees 35 grams (including silver).
MJ-190A: Lead free and halogen-free, medium temperature tin slurry 190 degrees 35 grams.
MJ-217A: Lead free and halogen-free, high temperature tin slurry 217 degrees 35 grams (including silver).
Features:
1. Small size, light weight, easy to carry and store, can be used for a long time.
2. The welding tin paste is very convenient to use, and it can be used many times.
3. Advanced insulation technology, high viscosity no-clean flux, can be used for PCB, SMD rework, and ball placement of computer and mobile phone chips.
4. Excellent welding performance, bright solder joints, strong conductivity, and increased silver particles.
5. Fine and viscous, high purity, no foaming, not easy to oxidize, uniform welding beads, strong welding.
Product parameters:
Brand: MiJing.
Model Number: MiJing 138A 158A 217A 190A.
Particle Size: 1-10μm.
Original: $2.89
-65%$2.89
$1.01More Images
MiJing 138A 158A 190A 217A Lead-free Solder Tin Paste
MiJing lead-free tin paste 138A 158A 217A 190A low/medium/high temperature solder flux paste for mobile phone motherboard CPU IC BGA SMD chips soldering repair.
Option:
MJ-138A: Lead free and halogen-free, low temperature tin paste 138 degrees 35 grams.
MJ-158A: Lead free and halogen-free, medium temperature tin slurry 158 degrees 35 grams (including silver).
MJ-190A: Lead free and halogen-free, medium temperature tin slurry 190 degrees 35 grams.
MJ-217A: Lead free and halogen-free, high temperature tin slurry 217 degrees 35 grams (including silver).
Features:
1. Small size, light weight, easy to carry and store, can be used for a long time.
2. The welding tin paste is very convenient to use, and it can be used many times.
3. Advanced insulation technology, high viscosity no-clean flux, can be used for PCB, SMD rework, and ball placement of computer and mobile phone chips.
4. Excellent welding performance, bright solder joints, strong conductivity, and increased silver particles.
5. Fine and viscous, high purity, no foaming, not easy to oxidize, uniform welding beads, strong welding.
Product parameters:
Brand: MiJing.
Model Number: MiJing 138A 158A 217A 190A.
Particle Size: 1-10μm.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
MiJing lead-free tin paste 138A 158A 217A 190A low/medium/high temperature solder flux paste for mobile phone motherboard CPU IC BGA SMD chips soldering repair.
Option:
MJ-138A: Lead free and halogen-free, low temperature tin paste 138 degrees 35 grams.
MJ-158A: Lead free and halogen-free, medium temperature tin slurry 158 degrees 35 grams (including silver).
MJ-190A: Lead free and halogen-free, medium temperature tin slurry 190 degrees 35 grams.
MJ-217A: Lead free and halogen-free, high temperature tin slurry 217 degrees 35 grams (including silver).
Features:
1. Small size, light weight, easy to carry and store, can be used for a long time.
2. The welding tin paste is very convenient to use, and it can be used many times.
3. Advanced insulation technology, high viscosity no-clean flux, can be used for PCB, SMD rework, and ball placement of computer and mobile phone chips.
4. Excellent welding performance, bright solder joints, strong conductivity, and increased silver particles.
5. Fine and viscous, high purity, no foaming, not easy to oxidize, uniform welding beads, strong welding.
Product parameters:
Brand: MiJing.
Model Number: MiJing 138A 158A 217A 190A.
Particle Size: 1-10μm.
