
MIJING High Purity Solder Tin Paste 138โ 158โ 183โ 199โ
MIJING High Purity Tin Paste 138/158/183/199โ Solder Paste for mobile phone motherboard/electronic circuit board/BGA chip welding repair. Large mouth bottle, easy to use. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points, suitable for various electronic motherboard BGA chip soldering and repair.
Option:
1. MIJING 138โ High Purity Tin Paste 50g.
3. MIJING 158โ High Purity Tin Paste 50g.
4. MIJING 183โ High Purity Tin Paste 50g.
5. MIJING 199โ High Purity Tin Paste 50g.
Features:
1. MIJING 138โ 158โ 183โ 199โ High Purity Tin Paste, 50G per box.
2. Square mouth design, easy to use, easy to recycle excess solder paste, reducing waste.
3. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points.
4. More stable welding, reducing the problem of false soldering.
5. Suitable for mobile phone motherboard/electronic circuit board/BGA chip welding repair.
6. Suitable for various electronic motherboard BGA chip soldering and repair.
7. It is a necessary solder paste for daily mobile phone repair.
Original: $2.99
-65%$2.99
$1.05More Images







MIJING High Purity Solder Tin Paste 138โ 158โ 183โ 199โ
MIJING High Purity Tin Paste 138/158/183/199โ Solder Paste for mobile phone motherboard/electronic circuit board/BGA chip welding repair. Large mouth bottle, easy to use. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points, suitable for various electronic motherboard BGA chip soldering and repair.
Option:
1. MIJING 138โ High Purity Tin Paste 50g.
3. MIJING 158โ High Purity Tin Paste 50g.
4. MIJING 183โ High Purity Tin Paste 50g.
5. MIJING 199โ High Purity Tin Paste 50g.
Features:
1. MIJING 138โ 158โ 183โ 199โ High Purity Tin Paste, 50G per box.
2. Square mouth design, easy to use, easy to recycle excess solder paste, reducing waste.
3. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points.
4. More stable welding, reducing the problem of false soldering.
5. Suitable for mobile phone motherboard/electronic circuit board/BGA chip welding repair.
6. Suitable for various electronic motherboard BGA chip soldering and repair.
7. It is a necessary solder paste for daily mobile phone repair.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
MIJING High Purity Tin Paste 138/158/183/199โ Solder Paste for mobile phone motherboard/electronic circuit board/BGA chip welding repair. Large mouth bottle, easy to use. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points, suitable for various electronic motherboard BGA chip soldering and repair.
Option:
1. MIJING 138โ High Purity Tin Paste 50g.
3. MIJING 158โ High Purity Tin Paste 50g.
4. MIJING 183โ High Purity Tin Paste 50g.
5. MIJING 199โ High Purity Tin Paste 50g.
Features:
1. MIJING 138โ 158โ 183โ 199โ High Purity Tin Paste, 50G per box.
2. Square mouth design, easy to use, easy to recycle excess solder paste, reducing waste.
3. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points.
4. More stable welding, reducing the problem of false soldering.
5. Suitable for mobile phone motherboard/electronic circuit board/BGA chip welding repair.
6. Suitable for various electronic motherboard BGA chip soldering and repair.
7. It is a necessary solder paste for daily mobile phone repair.
























