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MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ
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MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ

MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ

MIJING High Purity Tin Paste 138/158/183/199โ„ƒ Solder Paste for mobile phone motherboard/electronic circuit board/BGA chip welding repair. Large mouth bottle, easy to use. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points, suitable for various electronic motherboard BGA chip soldering and repair.

Option:
1. MIJING 138โ„ƒ High Purity Tin Paste 50g.
3. MIJING 158โ„ƒ High Purity Tin Paste 50g.
4. MIJING 183โ„ƒ High Purity Tin Paste 50g.
5. MIJING 199โ„ƒ High Purity Tin Paste 50g.

Features:
1. MIJING 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ High Purity Tin Paste, 50G per box.
2. Square mouth design, easy to use, easy to recycle excess solder paste, reducing waste.
3. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points.
4. More stable welding, reducing the problem of false soldering.
5. Suitable for mobile phone motherboard/electronic circuit board/BGA chip welding repair.
6. Suitable for various electronic motherboard BGA chip soldering and repair.
7. It is a necessary solder paste for daily mobile phone repair.

Select Option
Select Model
From $1.05

Original: $2.99

-65%
MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒโ€”

$2.99

$1.05

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MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ - Image 2
MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ - Image 3
MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ - Image 4
MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ - Image 5
MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ - Image 6
MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ - Image 7
MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ - Image 8

MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ

MIJING High Purity Tin Paste 138/158/183/199โ„ƒ Solder Paste for mobile phone motherboard/electronic circuit board/BGA chip welding repair. Large mouth bottle, easy to use. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points, suitable for various electronic motherboard BGA chip soldering and repair.

Option:
1. MIJING 138โ„ƒ High Purity Tin Paste 50g.
3. MIJING 158โ„ƒ High Purity Tin Paste 50g.
4. MIJING 183โ„ƒ High Purity Tin Paste 50g.
5. MIJING 199โ„ƒ High Purity Tin Paste 50g.

Features:
1. MIJING 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ High Purity Tin Paste, 50G per box.
2. Square mouth design, easy to use, easy to recycle excess solder paste, reducing waste.
3. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points.
4. More stable welding, reducing the problem of false soldering.
5. Suitable for mobile phone motherboard/electronic circuit board/BGA chip welding repair.
6. Suitable for various electronic motherboard BGA chip soldering and repair.
7. It is a necessary solder paste for daily mobile phone repair.

Product Information

Shipping & Returns

Description

MIJING High Purity Tin Paste 138/158/183/199โ„ƒ Solder Paste for mobile phone motherboard/electronic circuit board/BGA chip welding repair. Large mouth bottle, easy to use. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points, suitable for various electronic motherboard BGA chip soldering and repair.

Option:
1. MIJING 138โ„ƒ High Purity Tin Paste 50g.
3. MIJING 158โ„ƒ High Purity Tin Paste 50g.
4. MIJING 183โ„ƒ High Purity Tin Paste 50g.
5. MIJING 199โ„ƒ High Purity Tin Paste 50g.

Features:
1. MIJING 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ High Purity Tin Paste, 50G per box.
2. Square mouth design, easy to use, easy to recycle excess solder paste, reducing waste.
3. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points.
4. More stable welding, reducing the problem of false soldering.
5. Suitable for mobile phone motherboard/electronic circuit board/BGA chip welding repair.
6. Suitable for various electronic motherboard BGA chip soldering and repair.
7. It is a necessary solder paste for daily mobile phone repair.

MIJING High Purity Solder Tin Paste 138โ„ƒ 158โ„ƒ 183โ„ƒ 199โ„ƒ | CHINA PHONEFIX SHOP Team