MobiTool MT-09 Phone PCB CPU BGA IC Glue Removal Blade Kit

MobiTool MT-09 Adhensive Removing Blade Kit includes 6 different types of high-toughness, ultra-thin metal blades for mobile phone motherboard CPU BGA chip glue removal and repair. Featuring a non-slip double handle and a detachable cleaning brush, it is suitable for repairing and replacing mobile phone motherboard chips, disassembly and cleaning needs during motherboard repair.   

Feature:
1. 6 Blade Types: Hook blade, curved blade, pointing blade, straight blade, bevel blade, and wide blade, catering to different repair scenarios.
2. Ultra-thin, High-Toughness Blades: Combining rigidity and flexibility, with excellent oxidation resistance, they are not easily deformed and will not damage the motherboard.
3. Non-slip Double-Ended Handles: The textured metal non-slip design provides a stable grip and effectively prevents slippage and hand tremors.
4. Detachable Cleaning Design: Equipped with a fine steel wire cleaning brush for easy cleaning of blades and residue.
5. High-precision manufacturing: Each blade is designed for precise operation, ensuring safe and efficient removal of adhesives, insulating adhesives, and sealants.

Product Parameters
Name: Adhesive Removing Blade
Brand: MobiTool
Model: MT-09
Product Weight: 0.35-9.4g
Package Size: 125x40x25mm
Function: For the maintenance of mobile phone motherboard chips