Pre-Cut Thermal Silicone Pads 12x12x1.5mm 100Pcs/Box For Soldering
MECHANIC D100 Insulated Thermal Silicone Sheet 12*12*1.5mm pre-cut thermal conductive silicone pad for PCB CPU BGA chips repair. 2UUL SC02 Pre-Cut Thermal Silicone Pads 12x12x1.5mm 100Pcs/Box. WYLIE Pre-Cut Thermal Pads 12x12x1.5mm 100pcs/box For Mobile Phone Motherboard Chip Soldering Repair. 2UUL Pre-cut thermal silicone pads heatsink cooling conductive silicone pad for PC Phone CPU IC repair. MaAnt Pre-Cut Thermal Silicone Pad 12x12x1.5mm 100Pcs/Box For Phone Pad Macbook MotherBoard CPU Repair Fast Heat Dissipation. 100Pcs/Box Pre-Cut Thermal Silicone Pads 12x12x1.5mm for heat insulation Soldering.
Option:
1. 2UUL SC02 Pre-cut thermal pads (12x12x1.5mm 100pcs/box).
2. HMT Pre-cut thermal pads (12x12x1.5mm 100pcs/box).
3. WYLIE WL-30C Pre-cut thermal pads (12x12x1.5mm 100pcs/box).
4. MaAnt Pre-Cut Thermal Silicone Pad 12x12x1.5mm 100Pcs/Box.
5. Mechanic D100 Pre-Cut Thermal Silicone Pad 12x12x1.5mm 100Pcs/Box.
MECHANIC D100 Thermal Silicone Pad Features:
1. High thermal conductivity of 6.0W/MK, allowing the thermal paste to quickly fill the tiny gaps in electronic components, rapidly conducting and dissipating heat generated by high-power CPUs/GPUs.
2. High voltage and high temperature resistance, safe and stable.
3. Strong thermal conductivity and heat dissipation performance.
4. Strong insulation performance, providing comprehensive protection.
5. Provides excellent heat dissipation performance and worry-free insulation protection for electronic devices, suitable for various scenarios such as Apple iPhone and Android phones, high-power LED modules, and integrated chips.
Features:
- Selection of thermal silica film main objective is to reduce the contact thermal resistance between the heat source and heat sink surfaces in contact surfaces. Gap thermal silica film can be well filled with the contact surface.
- The thermal pad can greatly lower temperature and solve most of the soldering heatsink and heat insulation problem. Thermal pads are ultra soft and have good resilience. The thermal pad can be die-cut into various shapes, and easy to operate.
Original: $1.29
-65%$1.29
$0.45More Images
Pre-Cut Thermal Silicone Pads 12x12x1.5mm 100Pcs/Box For Soldering
MECHANIC D100 Insulated Thermal Silicone Sheet 12*12*1.5mm pre-cut thermal conductive silicone pad for PCB CPU BGA chips repair. 2UUL SC02 Pre-Cut Thermal Silicone Pads 12x12x1.5mm 100Pcs/Box. WYLIE Pre-Cut Thermal Pads 12x12x1.5mm 100pcs/box For Mobile Phone Motherboard Chip Soldering Repair. 2UUL Pre-cut thermal silicone pads heatsink cooling conductive silicone pad for PC Phone CPU IC repair. MaAnt Pre-Cut Thermal Silicone Pad 12x12x1.5mm 100Pcs/Box For Phone Pad Macbook MotherBoard CPU Repair Fast Heat Dissipation. 100Pcs/Box Pre-Cut Thermal Silicone Pads 12x12x1.5mm for heat insulation Soldering.
Option:
1. 2UUL SC02 Pre-cut thermal pads (12x12x1.5mm 100pcs/box).
2. HMT Pre-cut thermal pads (12x12x1.5mm 100pcs/box).
3. WYLIE WL-30C Pre-cut thermal pads (12x12x1.5mm 100pcs/box).
4. MaAnt Pre-Cut Thermal Silicone Pad 12x12x1.5mm 100Pcs/Box.
5. Mechanic D100 Pre-Cut Thermal Silicone Pad 12x12x1.5mm 100Pcs/Box.
MECHANIC D100 Thermal Silicone Pad Features:
1. High thermal conductivity of 6.0W/MK, allowing the thermal paste to quickly fill the tiny gaps in electronic components, rapidly conducting and dissipating heat generated by high-power CPUs/GPUs.
2. High voltage and high temperature resistance, safe and stable.
3. Strong thermal conductivity and heat dissipation performance.
4. Strong insulation performance, providing comprehensive protection.
5. Provides excellent heat dissipation performance and worry-free insulation protection for electronic devices, suitable for various scenarios such as Apple iPhone and Android phones, high-power LED modules, and integrated chips.
Features:
- Selection of thermal silica film main objective is to reduce the contact thermal resistance between the heat source and heat sink surfaces in contact surfaces. Gap thermal silica film can be well filled with the contact surface.
- The thermal pad can greatly lower temperature and solve most of the soldering heatsink and heat insulation problem. Thermal pads are ultra soft and have good resilience. The thermal pad can be die-cut into various shapes, and easy to operate.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
MECHANIC D100 Insulated Thermal Silicone Sheet 12*12*1.5mm pre-cut thermal conductive silicone pad for PCB CPU BGA chips repair. 2UUL SC02 Pre-Cut Thermal Silicone Pads 12x12x1.5mm 100Pcs/Box. WYLIE Pre-Cut Thermal Pads 12x12x1.5mm 100pcs/box For Mobile Phone Motherboard Chip Soldering Repair. 2UUL Pre-cut thermal silicone pads heatsink cooling conductive silicone pad for PC Phone CPU IC repair. MaAnt Pre-Cut Thermal Silicone Pad 12x12x1.5mm 100Pcs/Box For Phone Pad Macbook MotherBoard CPU Repair Fast Heat Dissipation. 100Pcs/Box Pre-Cut Thermal Silicone Pads 12x12x1.5mm for heat insulation Soldering.
Option:
1. 2UUL SC02 Pre-cut thermal pads (12x12x1.5mm 100pcs/box).
2. HMT Pre-cut thermal pads (12x12x1.5mm 100pcs/box).
3. WYLIE WL-30C Pre-cut thermal pads (12x12x1.5mm 100pcs/box).
4. MaAnt Pre-Cut Thermal Silicone Pad 12x12x1.5mm 100Pcs/Box.
5. Mechanic D100 Pre-Cut Thermal Silicone Pad 12x12x1.5mm 100Pcs/Box.
MECHANIC D100 Thermal Silicone Pad Features:
1. High thermal conductivity of 6.0W/MK, allowing the thermal paste to quickly fill the tiny gaps in electronic components, rapidly conducting and dissipating heat generated by high-power CPUs/GPUs.
2. High voltage and high temperature resistance, safe and stable.
3. Strong thermal conductivity and heat dissipation performance.
4. Strong insulation performance, providing comprehensive protection.
5. Provides excellent heat dissipation performance and worry-free insulation protection for electronic devices, suitable for various scenarios such as Apple iPhone and Android phones, high-power LED modules, and integrated chips.
Features:
- Selection of thermal silica film main objective is to reduce the contact thermal resistance between the heat source and heat sink surfaces in contact surfaces. Gap thermal silica film can be well filled with the contact surface.
- The thermal pad can greatly lower temperature and solve most of the soldering heatsink and heat insulation problem. Thermal pads are ultra soft and have good resilience. The thermal pad can be die-cut into various shapes, and easy to operate.
