QIANLI MEGA-IDEA iSocket iPhone 17 Series PCB Layered Test Fixture

QianLi MEGA-IDEA iScoket motherboard layered test fixture for iPhone 17/17 Air/17 Pro/17 Pro Max mainboard function testing. QIANLI MEGA-IDEA iSocket iPhone 17 Series 4-in-1 Motherboard Layered Test Frame features precise alignment, high-quality probes, and ease of use, and is specifically designed for iPhone 17 series repair.

Option:
1. Qianli iSocket for iPhone 17/17 Air/17 Pro/17 Pro Max.
2. MEGA-IDEA iSocket for iPhone 17/17 Air/17 Pro/17 Pro Max.

Features:
1. Precise Alignment: Dual-headed probes with small alignment holes improve contact performance, and the fixing clip design effectively prevents the motherboard from lifting, ensuring accurate test data.
2. High-Quality Probes: Uses imported beryllium copper spring probes, which have good conductivity, small detection value deviation, and overload stability. The tapered probe design avoids rosin and solder adhesion, improving lifespan and accuracy.
3. CNC High-Precision Machining: Utilizing CNC machine tools for precision machining, ensuring high standards in every detail and enhancing the stability and accuracy of the equipment.
4. Convenient and Quick Operation: The spring-loaded buckle design allows for rapid rebound and quick installation, reducing operation time.
5. Anti-Slip Design: Equipped with anti-slip feet to increase stability and prevent slippage or damage.

Product Parameters:
Name: iSocket Layered Motherboard Test Fixture
Brand: Qianli/Mega-idea
Material: Aluminum Alloy
Function: Motherboard Test, BGA Reballing

Operating Steps:
1. Place the lower motherboard layer on the test fixture base.
2. Secure the probe plate on top of the lower motherboard layer.
3. Secure the upper motherboard layer on top of the probe plate.
4. Align and fasten the test fixture cover, ensuring both wings are tightly closed.