UP200 Lead Free Nano Solder Paste Phone BGA Reballing Solder Flux

Aixun UP200 Lead Free Nano Solder Paste Solder Flux for BGA Reballing Repair Tool. Suitable for BGA ball planting, rework, component soldering, repair soldering, etc. of precision electronic devices. Exclusive formula, no cleaning, no corrosion, high permeability, excellent fluidity, transparent colorless liquid, strong welding ability.

Features:

1. Aixun UP200 solder paste is made from a special lead-free formula.
2. It can easily handle BGA ball planting, rework, component drag soldering, repair soldering and other mobile phone repair work.
3. This nano lead-free solder oil is an essential maintenance tool for soldering and desoldering operations.
4. Exclusive formula, no clean, no corrosion, high permeability, good liquidity, limpid liquid.
5. Less smoke, no smell, lead free and environmental protection.
6. Limpid and transparent, strong liquidity.
7. Good insulation and high activity, not easy to oxidize or rust.

List of Packing:

• 1 x Lead-free nano solder paste