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WL 2 In 1 CPU NAND BGA Reballing Stencil Platform for iPhone 6-XSM
WL 2-IN-1 CPU NAND Baseband IC BGA Reballing Stencil Platform Positioning Mold for iPhone 6 6S 7 8 X XR XS XS Max
Description :
Features :
Optional Positioning Plate (Black) : Not universal, can't working with different BGA Reballing Stencil
Need the right model BGA Reballing Stencil, the Black Positioning Plate just match with the right BGA Reballing Stencil
Package included :
Description :
- When you purchase this product for the first time, you must first purchase the magnetic base
- Magnetic base + Positioning plate + Tin mesh (Together to use)
Features :
- 0.1-0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing solder working
- It is the top quality BGA Reballing Stencil for iPhone CPU and NAND, A9 / A8 / A10 / A11 / A12
- WL Top quality fast speed BGA Reballing Solder Template Stencil
Optional Positioning Plate (Black) : Not universal, can't working with different BGA Reballing Stencil
Need the right model BGA Reballing Stencil, the Black Positioning Plate just match with the right BGA Reballing Stencil
Package included :
- 1pc x BGA Reballing Stencil
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From $2.43
Original: $6.95
-65%WL 2 In 1 CPU NAND BGA Reballing Stencil Platform for iPhone 6-XSM—
$6.95
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WL 2 In 1 CPU NAND BGA Reballing Stencil Platform for iPhone 6-XSM
WL 2-IN-1 CPU NAND Baseband IC BGA Reballing Stencil Platform Positioning Mold for iPhone 6 6S 7 8 X XR XS XS Max
Description :
Features :
Optional Positioning Plate (Black) : Not universal, can't working with different BGA Reballing Stencil
Need the right model BGA Reballing Stencil, the Black Positioning Plate just match with the right BGA Reballing Stencil
Package included :
Description :
- When you purchase this product for the first time, you must first purchase the magnetic base
- Magnetic base + Positioning plate + Tin mesh (Together to use)
Features :
- 0.1-0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing solder working
- It is the top quality BGA Reballing Stencil for iPhone CPU and NAND, A9 / A8 / A10 / A11 / A12
- WL Top quality fast speed BGA Reballing Solder Template Stencil
Optional Positioning Plate (Black) : Not universal, can't working with different BGA Reballing Stencil
Need the right model BGA Reballing Stencil, the Black Positioning Plate just match with the right BGA Reballing Stencil
Package included :
- 1pc x BGA Reballing Stencil
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
WL 2-IN-1 CPU NAND Baseband IC BGA Reballing Stencil Platform Positioning Mold for iPhone 6 6S 7 8 X XR XS XS Max
Description :
Features :
Optional Positioning Plate (Black) : Not universal, can't working with different BGA Reballing Stencil
Need the right model BGA Reballing Stencil, the Black Positioning Plate just match with the right BGA Reballing Stencil
Package included :
Description :
- When you purchase this product for the first time, you must first purchase the magnetic base
- Magnetic base + Positioning plate + Tin mesh (Together to use)
Features :
- 0.1-0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing solder working
- It is the top quality BGA Reballing Stencil for iPhone CPU and NAND, A9 / A8 / A10 / A11 / A12
- WL Top quality fast speed BGA Reballing Solder Template Stencil
Optional Positioning Plate (Black) : Not universal, can't working with different BGA Reballing Stencil
Need the right model BGA Reballing Stencil, the Black Positioning Plate just match with the right BGA Reballing Stencil
Package included :
- 1pc x BGA Reballing Stencil
