XZZ D004 PCB IC Glue Removal Blade Phone Repair Kit

XZZ D004 Multifunctional 4-in-1 Hand-Polished Blade Phone Fixing Kit for Mobile Phone Motherboard Layering IC Prying and Glue Removing. XZZ D004 blade kit with aluminum alloy handle and A B C D knife for a variety of mobile phone repair tasks or other electronic circuit board repair needs, such as IC prying, motherboard chip layering, glue scraping and glue removal.

Features:
1. XINZHIZAO XZZ D004 multi-function glue removal knife is a common tool for mobile phone repair.
2. High-temperature resistance, corrosion resistance, high hardness, high toughness.
3. The high-carbon spring steel blade is perfectly polished, has excellent resilience and is not easily deformed after rebound.
4. High carbon spring steel blade has a smooth and even polished surface, good wear resistance and corrosion resistance.
5. The press-fit design with high-quality built-in spring has high resilience, stable and firm clamping, and easy and stable operation.
6. Aluminum alloy handle with diamond pattern for anti-slip, electroplated anti-oxidation silver copper head, and pressure head.
7. There are 4 different types of blades:
A blade: Motherboard chip layering.
B blade: IC chip prying, motherboard layering.
C blade: Professional glue scraping tool.
D blade: IC, motherboard adhesive removal.

Option:
1. XZZ D004 blade set: 1 handle + 4 different blades.
2. A blade (4pcs).
3. B blade (4pcs).
4. C blade (4pcs).
5. D blade (4pcs).
6. ABCD blade (4pcs).