XZZ GL-01 GL-02 Heat Resistant Glass Fixture Phone PCB IC Clamp
Option:
1. XZZ GL-01 Circular Glass Clamp.
2. XZZ GL-02 Square Glass Clamp.
XZZ GL-01 Glass Fixture Features:
1. Precise Clamping Design: The new V-shaped clamping structure precisely secures various mobile phone motherboards and chips, preventing them from shifting during repair.
2. High Transmission and Corrosion Resistance: The highly transparent tempered glass panel offers strong corrosion resistance and is easy to clean, allowing for long-term cleanliness.
3. High-Temperature Resistance: The panel and mounting bracket are heat-resistant up to 600°C and maintain deformation over time, making it suitable for repair work in high-temperature environments.
4. Strong Compatibility: The bidirectional movement design is compatible with chips, motherboards, CPUs, and other ICs of varying sizes and models, meeting a wide range of repair needs.
5. Secure Clamping: The tight and secure clamping structure ensures the motherboard and chip remain secure during operation, improving repair efficiency.
6. Compact and Portable: The compact size makes it suitable for a variety of repair scenarios and easy to carry and use.
XZZ GL-02 Glass Fixture Features:
1. High Transmittance and Corrosion Resistance: The highly transparent tempered glass panel offers excellent corrosion resistance, is easy to clean, and maintains the panel's long-lasting beauty.
2. High-Temperature Resistance: The panel and synthetic stone fixture can withstand temperatures up to 600°C and withstand prolonged high-temperature operation without deformation.
3. Precise Locking Design: The new V-shaped, beveled latch structure precisely secures various mobile phone motherboards and chips, preventing them from shifting during repairs.
4. Secure Clamping: The clamping mechanism is tight and stable, preventing the motherboard or chip from loosening during operation, improving accuracy and efficiency during repairs.
5. Strong Compatibility: The bidirectional movement design supports a wide range of motherboards, chips, CPUs, and other IC components, ensuring excellent compatibility.
6. Convenient Cleaning: The one-wipe-clean design makes the tempered glass panel resistant to stains and easy to maintain.
XZZ GL-01 Specifications:
Model: XZZ GL-01 Rotating Circular Clamp
Net Weight: 290g
Gross Weight: 420g
Clamping Stroke: 5-75mm
Dimensions: 142x110x21mm
Packaging Dimensions: 165x128x33mm
XZZ GL-02 Glass Clamp Specifications:
Product Name: XZZ GL-02 Square Tempered Heat Insulating Glass Fixture
Net Weight: 160g
Gross Weight: 250g
Clamping Stroke: 6-68mm
Dimensions: 145x60x15mm
Packaging Dimensions: 163x78x33mm
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XZZ GL-01 GL-02 Heat Resistant Glass Fixture Phone PCB IC Clamp
Option:
1. XZZ GL-01 Circular Glass Clamp.
2. XZZ GL-02 Square Glass Clamp.
XZZ GL-01 Glass Fixture Features:
1. Precise Clamping Design: The new V-shaped clamping structure precisely secures various mobile phone motherboards and chips, preventing them from shifting during repair.
2. High Transmission and Corrosion Resistance: The highly transparent tempered glass panel offers strong corrosion resistance and is easy to clean, allowing for long-term cleanliness.
3. High-Temperature Resistance: The panel and mounting bracket are heat-resistant up to 600°C and maintain deformation over time, making it suitable for repair work in high-temperature environments.
4. Strong Compatibility: The bidirectional movement design is compatible with chips, motherboards, CPUs, and other ICs of varying sizes and models, meeting a wide range of repair needs.
5. Secure Clamping: The tight and secure clamping structure ensures the motherboard and chip remain secure during operation, improving repair efficiency.
6. Compact and Portable: The compact size makes it suitable for a variety of repair scenarios and easy to carry and use.
XZZ GL-02 Glass Fixture Features:
1. High Transmittance and Corrosion Resistance: The highly transparent tempered glass panel offers excellent corrosion resistance, is easy to clean, and maintains the panel's long-lasting beauty.
2. High-Temperature Resistance: The panel and synthetic stone fixture can withstand temperatures up to 600°C and withstand prolonged high-temperature operation without deformation.
3. Precise Locking Design: The new V-shaped, beveled latch structure precisely secures various mobile phone motherboards and chips, preventing them from shifting during repairs.
4. Secure Clamping: The clamping mechanism is tight and stable, preventing the motherboard or chip from loosening during operation, improving accuracy and efficiency during repairs.
5. Strong Compatibility: The bidirectional movement design supports a wide range of motherboards, chips, CPUs, and other IC components, ensuring excellent compatibility.
6. Convenient Cleaning: The one-wipe-clean design makes the tempered glass panel resistant to stains and easy to maintain.
XZZ GL-01 Specifications:
Model: XZZ GL-01 Rotating Circular Clamp
Net Weight: 290g
Gross Weight: 420g
Clamping Stroke: 5-75mm
Dimensions: 142x110x21mm
Packaging Dimensions: 165x128x33mm
XZZ GL-02 Glass Clamp Specifications:
Product Name: XZZ GL-02 Square Tempered Heat Insulating Glass Fixture
Net Weight: 160g
Gross Weight: 250g
Clamping Stroke: 6-68mm
Dimensions: 145x60x15mm
Packaging Dimensions: 163x78x33mm
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Description
Option:
1. XZZ GL-01 Circular Glass Clamp.
2. XZZ GL-02 Square Glass Clamp.
XZZ GL-01 Glass Fixture Features:
1. Precise Clamping Design: The new V-shaped clamping structure precisely secures various mobile phone motherboards and chips, preventing them from shifting during repair.
2. High Transmission and Corrosion Resistance: The highly transparent tempered glass panel offers strong corrosion resistance and is easy to clean, allowing for long-term cleanliness.
3. High-Temperature Resistance: The panel and mounting bracket are heat-resistant up to 600°C and maintain deformation over time, making it suitable for repair work in high-temperature environments.
4. Strong Compatibility: The bidirectional movement design is compatible with chips, motherboards, CPUs, and other ICs of varying sizes and models, meeting a wide range of repair needs.
5. Secure Clamping: The tight and secure clamping structure ensures the motherboard and chip remain secure during operation, improving repair efficiency.
6. Compact and Portable: The compact size makes it suitable for a variety of repair scenarios and easy to carry and use.
XZZ GL-02 Glass Fixture Features:
1. High Transmittance and Corrosion Resistance: The highly transparent tempered glass panel offers excellent corrosion resistance, is easy to clean, and maintains the panel's long-lasting beauty.
2. High-Temperature Resistance: The panel and synthetic stone fixture can withstand temperatures up to 600°C and withstand prolonged high-temperature operation without deformation.
3. Precise Locking Design: The new V-shaped, beveled latch structure precisely secures various mobile phone motherboards and chips, preventing them from shifting during repairs.
4. Secure Clamping: The clamping mechanism is tight and stable, preventing the motherboard or chip from loosening during operation, improving accuracy and efficiency during repairs.
5. Strong Compatibility: The bidirectional movement design supports a wide range of motherboards, chips, CPUs, and other IC components, ensuring excellent compatibility.
6. Convenient Cleaning: The one-wipe-clean design makes the tempered glass panel resistant to stains and easy to maintain.
XZZ GL-01 Specifications:
Model: XZZ GL-01 Rotating Circular Clamp
Net Weight: 290g
Gross Weight: 420g
Clamping Stroke: 5-75mm
Dimensions: 142x110x21mm
Packaging Dimensions: 165x128x33mm
XZZ GL-02 Glass Clamp Specifications:
Product Name: XZZ GL-02 Square Tempered Heat Insulating Glass Fixture
Net Weight: 160g
Gross Weight: 250g
Clamping Stroke: 6-68mm
Dimensions: 145x60x15mm
Packaging Dimensions: 163x78x33mm
