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XZZ iPhone 15 Series 4 In 1 Motherboard Layered Test Fixture
XZZ Phone15 Series Motherboard Test Racks For iPhone 15/15 Plus/15 Pro/15 Pro Max Logic Board Repair. XZZ iPhone 15 Series 4 In 1 Motherboard Layered Test Fixture with gold-plated spring probes for testing iPhone 15 series motherboard function before installation.
Option:
1. XZZ 15 Series motherboard fixture: SIM Card version.
2. XZZ 15 Series motherboard fixture: eSIM US version.
Please note:
1. The SIM Card plug-in version has a hole for inserting the card, but the eSIM has no hole, so there is no need to insert the card and the mobile phone number can be written directly.
2. The United States uses the eSIM US version, and other countries use the SIM Card version. If you need to repair the iPhone(US version) later, you can just buy a separate US version of the pin board.
Features:
1. XZZ 15 delamination test frame 4 in 1 socket for iPhone 15/15 Plus/15 Pro/15 Pro Max motherboard test repair. For iPhone 15 Pro/15 Pro Max SIM Card insertion version/eSIM US version.
2. XZZ 15 series motherboard test fixture solves the problem of repeated lamination and delamination in the process of motherboard repair.
3. Using a high-quality beryllium copper spring probe, with good conductivity, product overload stability, small deviation of detection value, and more accuracy, the tapered probe is not easy to get rosin, solder.
4. Simple and fast operation, easy to use.
Option:
1. XZZ 15 Series motherboard fixture: SIM Card version.
2. XZZ 15 Series motherboard fixture: eSIM US version.
Please note:
1. The SIM Card plug-in version has a hole for inserting the card, but the eSIM has no hole, so there is no need to insert the card and the mobile phone number can be written directly.
2. The United States uses the eSIM US version, and other countries use the SIM Card version. If you need to repair the iPhone(US version) later, you can just buy a separate US version of the pin board.
Features:
1. XZZ 15 delamination test frame 4 in 1 socket for iPhone 15/15 Plus/15 Pro/15 Pro Max motherboard test repair. For iPhone 15 Pro/15 Pro Max SIM Card insertion version/eSIM US version.
2. XZZ 15 series motherboard test fixture solves the problem of repeated lamination and delamination in the process of motherboard repair.
3. Using a high-quality beryllium copper spring probe, with good conductivity, product overload stability, small deviation of detection value, and more accuracy, the tapered probe is not easy to get rosin, solder.
4. Simple and fast operation, easy to use.
Select Option
From $44.10
Original: $125.99
-65%XZZ iPhone 15 Series 4 In 1 Motherboard Layered Test Fixture—
$125.99
$44.10More Images
XZZ iPhone 15 Series 4 In 1 Motherboard Layered Test Fixture
XZZ Phone15 Series Motherboard Test Racks For iPhone 15/15 Plus/15 Pro/15 Pro Max Logic Board Repair. XZZ iPhone 15 Series 4 In 1 Motherboard Layered Test Fixture with gold-plated spring probes for testing iPhone 15 series motherboard function before installation.
Option:
1. XZZ 15 Series motherboard fixture: SIM Card version.
2. XZZ 15 Series motherboard fixture: eSIM US version.
Please note:
1. The SIM Card plug-in version has a hole for inserting the card, but the eSIM has no hole, so there is no need to insert the card and the mobile phone number can be written directly.
2. The United States uses the eSIM US version, and other countries use the SIM Card version. If you need to repair the iPhone(US version) later, you can just buy a separate US version of the pin board.
Features:
1. XZZ 15 delamination test frame 4 in 1 socket for iPhone 15/15 Plus/15 Pro/15 Pro Max motherboard test repair. For iPhone 15 Pro/15 Pro Max SIM Card insertion version/eSIM US version.
2. XZZ 15 series motherboard test fixture solves the problem of repeated lamination and delamination in the process of motherboard repair.
3. Using a high-quality beryllium copper spring probe, with good conductivity, product overload stability, small deviation of detection value, and more accuracy, the tapered probe is not easy to get rosin, solder.
4. Simple and fast operation, easy to use.
Option:
1. XZZ 15 Series motherboard fixture: SIM Card version.
2. XZZ 15 Series motherboard fixture: eSIM US version.
Please note:
1. The SIM Card plug-in version has a hole for inserting the card, but the eSIM has no hole, so there is no need to insert the card and the mobile phone number can be written directly.
2. The United States uses the eSIM US version, and other countries use the SIM Card version. If you need to repair the iPhone(US version) later, you can just buy a separate US version of the pin board.
Features:
1. XZZ 15 delamination test frame 4 in 1 socket for iPhone 15/15 Plus/15 Pro/15 Pro Max motherboard test repair. For iPhone 15 Pro/15 Pro Max SIM Card insertion version/eSIM US version.
2. XZZ 15 series motherboard test fixture solves the problem of repeated lamination and delamination in the process of motherboard repair.
3. Using a high-quality beryllium copper spring probe, with good conductivity, product overload stability, small deviation of detection value, and more accuracy, the tapered probe is not easy to get rosin, solder.
4. Simple and fast operation, easy to use.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
XZZ Phone15 Series Motherboard Test Racks For iPhone 15/15 Plus/15 Pro/15 Pro Max Logic Board Repair. XZZ iPhone 15 Series 4 In 1 Motherboard Layered Test Fixture with gold-plated spring probes for testing iPhone 15 series motherboard function before installation.
Option:
1. XZZ 15 Series motherboard fixture: SIM Card version.
2. XZZ 15 Series motherboard fixture: eSIM US version.
Please note:
1. The SIM Card plug-in version has a hole for inserting the card, but the eSIM has no hole, so there is no need to insert the card and the mobile phone number can be written directly.
2. The United States uses the eSIM US version, and other countries use the SIM Card version. If you need to repair the iPhone(US version) later, you can just buy a separate US version of the pin board.
Features:
1. XZZ 15 delamination test frame 4 in 1 socket for iPhone 15/15 Plus/15 Pro/15 Pro Max motherboard test repair. For iPhone 15 Pro/15 Pro Max SIM Card insertion version/eSIM US version.
2. XZZ 15 series motherboard test fixture solves the problem of repeated lamination and delamination in the process of motherboard repair.
3. Using a high-quality beryllium copper spring probe, with good conductivity, product overload stability, small deviation of detection value, and more accuracy, the tapered probe is not easy to get rosin, solder.
4. Simple and fast operation, easy to use.
Option:
1. XZZ 15 Series motherboard fixture: SIM Card version.
2. XZZ 15 Series motherboard fixture: eSIM US version.
Please note:
1. The SIM Card plug-in version has a hole for inserting the card, but the eSIM has no hole, so there is no need to insert the card and the mobile phone number can be written directly.
2. The United States uses the eSIM US version, and other countries use the SIM Card version. If you need to repair the iPhone(US version) later, you can just buy a separate US version of the pin board.
Features:
1. XZZ 15 delamination test frame 4 in 1 socket for iPhone 15/15 Plus/15 Pro/15 Pro Max motherboard test repair. For iPhone 15 Pro/15 Pro Max SIM Card insertion version/eSIM US version.
2. XZZ 15 series motherboard test fixture solves the problem of repeated lamination and delamination in the process of motherboard repair.
3. Using a high-quality beryllium copper spring probe, with good conductivity, product overload stability, small deviation of detection value, and more accuracy, the tapered probe is not easy to get rosin, solder.
4. Simple and fast operation, easy to use.
