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XZZ Lead Free Tin Paste 138/158/183/199โ Solder Flux
XZZ Tin Paste 138โ 158โ 183โ 199โ Solder Flux For Mobile Phone iPad Tablet Logic Board PCB BGA SMD PGA Welding Desoldering Repair. XZZ low/medium/high temperature leaded/lead-free solder flux paste.ย
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138โ, 158โ, 183โ, 199โ.
Option:
1. XZZ lead-free low-temperature solder paste 138โ.
2. XZZ lead-free medium-temperature solder paste 158โ, contains silver.
3. XZZ leaded medium-temperature solder paste 183โ, contains silver.
4. XZZ leaded high-temperature solder paste 199โ, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138โ, 158โ, 183โ, 199โ.
Option:
1. XZZ lead-free low-temperature solder paste 138โ.
2. XZZ lead-free medium-temperature solder paste 158โ, contains silver.
3. XZZ leaded medium-temperature solder paste 183โ, contains silver.
4. XZZ leaded high-temperature solder paste 199โ, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
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From $1.05
Original: $2.99
-65%XZZ Lead Free Tin Paste 138/158/183/199โ Solder Fluxโ
$2.99
$1.05More Images
XZZ Lead Free Tin Paste 138/158/183/199โ Solder Flux
XZZ Tin Paste 138โ 158โ 183โ 199โ Solder Flux For Mobile Phone iPad Tablet Logic Board PCB BGA SMD PGA Welding Desoldering Repair. XZZ low/medium/high temperature leaded/lead-free solder flux paste.ย
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138โ, 158โ, 183โ, 199โ.
Option:
1. XZZ lead-free low-temperature solder paste 138โ.
2. XZZ lead-free medium-temperature solder paste 158โ, contains silver.
3. XZZ leaded medium-temperature solder paste 183โ, contains silver.
4. XZZ leaded high-temperature solder paste 199โ, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138โ, 158โ, 183โ, 199โ.
Option:
1. XZZ lead-free low-temperature solder paste 138โ.
2. XZZ lead-free medium-temperature solder paste 158โ, contains silver.
3. XZZ leaded medium-temperature solder paste 183โ, contains silver.
4. XZZ leaded high-temperature solder paste 199โ, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
XZZ Tin Paste 138โ 158โ 183โ 199โ Solder Flux For Mobile Phone iPad Tablet Logic Board PCB BGA SMD PGA Welding Desoldering Repair. XZZ low/medium/high temperature leaded/lead-free solder flux paste.ย
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138โ, 158โ, 183โ, 199โ.
Option:
1. XZZ lead-free low-temperature solder paste 138โ.
2. XZZ lead-free medium-temperature solder paste 158โ, contains silver.
3. XZZ leaded medium-temperature solder paste 183โ, contains silver.
4. XZZ leaded high-temperature solder paste 199โ, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138โ, 158โ, 183โ, 199โ.
Option:
1. XZZ lead-free low-temperature solder paste 138โ.
2. XZZ lead-free medium-temperature solder paste 158โ, contains silver.
3. XZZ leaded medium-temperature solder paste 183โ, contains silver.
4. XZZ leaded high-temperature solder paste 199โ, contains silver.
Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.
