XZZ Non-Magnetic Solder Paste Tin Scraper for Phone BGA PCB Repair

XZZ Non-Magnetic High-toughness Tin Scraper Blade for Mobile Phone BGA PCB Repair. 0.2mm non-magnetic stainless steel tip and soft, flexible silicone handle design ensure even tinning application of solder paste, making solder paste reballing on mobile phone BGA CPU chips more efficient and successful.

Features:
1. Scrape & Pry—Multi-functional Tool: Not only serves to scrape away solder but can also be used to gently pry up electronic components; its versatile functionality meets a wide range of repair requirements.
2. Hard yet Resilient: The blade tip is crafted from high-quality, non-magnetic stainless steel, offering exceptional durability and resilience to ensure it remains undamaged even after prolonged use.
3. Uniform Scraping & Non-Stick: The non-magnetic blade tip ensures that solder material does not adhere to the tool during the scraping process, resulting in cleaner and more precise operations.
4. Soft, Resilient Silicone Handle: Provides a comfortable grip; the ergonomically designed handle reduces hand fatigue and enhances overall operational comfort.
5. Ultra-Thin Blade Tip: The 0.2mm thick blade tip allows for highly precise solder scraping while minimizing the risk of damaging surrounding components.

Product Specification:
Brand: XZZ
Handle Height: 20mm
Blade Material: Non-magnetic Stainless Steel (0.2mm thickness)
Handle Material: Soft, Resilient Silicone
Functions: Solder scraping, component prying, solder pad cleaning, etc.