🎉 Up to 70% Off Selected ItemsShop Sale
YCS DB02 Spudger Blade Set for Phone CPU Nand IC Glue Removal
HomeStore

YCS DB02 Spudger Blade Set for Phone CPU Nand IC Glue Removal

YCS DB02 Spudger Blade Set for Phone CPU Nand IC Glue Removal

YCS DB02 Multi-Function Spudger Blade Set for mobile phone CPU Nand Flash Chips Removal and Glue Removal. YCS DB02 blade set includes a non-slip textured handle, sturdy blades, and a high-quality metal case for easy portability and storage, suitable for repairing mobile phones, electronic circuits, tablets, and other digital devices.


Features:

1. Non-slip textured handle: Provides a secure grip and ensures stable operation.
2. Strong blade: The blade is extremely strong and durable, suitable for a variety of repair environments.
3. Premium metal case: The high-quality metal case is durable and easy to carry.
4. 9-in-1 tool set: Includes three 9G handles and six different blades to meet various disassembly and repair needs.
5. Lightweight design: Reduces operator burden and improves repair efficiency.
6. Suitable for various repair scenarios: Especially suitable for removing glue and disassembling mobile phone motherboards, as well as repairing tablets, electronic circuits, and other devices.

Specifications:
Model: YCS DB02
Product Name: Multi-functional Knife
Dimensions: 140x8mm
Packaging Dimensions: 60x175x20
Applications: Repair of mobile phones, electronic circuits, tablets, and other digital devices.

Product List
Exquisite Iron Case x1
9G Handle x3
Blades x6

$2.48

Original: $7.09

-65%
YCS DB02 Spudger Blade Set for Phone CPU Nand IC Glue Removal

$7.09

$2.48

More Images

YCS DB02 Spudger Blade Set for Phone CPU Nand IC Glue Removal - Image 2
YCS DB02 Spudger Blade Set for Phone CPU Nand IC Glue Removal - Image 3
YCS DB02 Spudger Blade Set for Phone CPU Nand IC Glue Removal - Image 4
YCS DB02 Spudger Blade Set for Phone CPU Nand IC Glue Removal - Image 5
YCS DB02 Spudger Blade Set for Phone CPU Nand IC Glue Removal - Image 6

YCS DB02 Spudger Blade Set for Phone CPU Nand IC Glue Removal

YCS DB02 Multi-Function Spudger Blade Set for mobile phone CPU Nand Flash Chips Removal and Glue Removal. YCS DB02 blade set includes a non-slip textured handle, sturdy blades, and a high-quality metal case for easy portability and storage, suitable for repairing mobile phones, electronic circuits, tablets, and other digital devices.


Features:

1. Non-slip textured handle: Provides a secure grip and ensures stable operation.
2. Strong blade: The blade is extremely strong and durable, suitable for a variety of repair environments.
3. Premium metal case: The high-quality metal case is durable and easy to carry.
4. 9-in-1 tool set: Includes three 9G handles and six different blades to meet various disassembly and repair needs.
5. Lightweight design: Reduces operator burden and improves repair efficiency.
6. Suitable for various repair scenarios: Especially suitable for removing glue and disassembling mobile phone motherboards, as well as repairing tablets, electronic circuits, and other devices.

Specifications:
Model: YCS DB02
Product Name: Multi-functional Knife
Dimensions: 140x8mm
Packaging Dimensions: 60x175x20
Applications: Repair of mobile phones, electronic circuits, tablets, and other digital devices.

Product List
Exquisite Iron Case x1
9G Handle x3
Blades x6

Product Information

Shipping & Returns

Description

YCS DB02 Multi-Function Spudger Blade Set for mobile phone CPU Nand Flash Chips Removal and Glue Removal. YCS DB02 blade set includes a non-slip textured handle, sturdy blades, and a high-quality metal case for easy portability and storage, suitable for repairing mobile phones, electronic circuits, tablets, and other digital devices.


Features:

1. Non-slip textured handle: Provides a secure grip and ensures stable operation.
2. Strong blade: The blade is extremely strong and durable, suitable for a variety of repair environments.
3. Premium metal case: The high-quality metal case is durable and easy to carry.
4. 9-in-1 tool set: Includes three 9G handles and six different blades to meet various disassembly and repair needs.
5. Lightweight design: Reduces operator burden and improves repair efficiency.
6. Suitable for various repair scenarios: Especially suitable for removing glue and disassembling mobile phone motherboards, as well as repairing tablets, electronic circuits, and other devices.

Specifications:
Model: YCS DB02
Product Name: Multi-functional Knife
Dimensions: 140x8mm
Packaging Dimensions: 60x175x20
Applications: Repair of mobile phones, electronic circuits, tablets, and other digital devices.

Product List
Exquisite Iron Case x1
9G Handle x3
Blades x6

YCS DB02 Spudger Blade Set for Phone CPU Nand IC Glue Removal | CHINA PHONEFIX SHOP Team