YCS M.Y Stainless Steel Tin Scraper for Phone IC BGA Reballing Repair

YCS Mr. Yang M.Y High-toughness Non-magnetic Stainless Steel Tin Scraper for scraping/prying solder paste in BGA Reballing Tin Planting during mobile phone repair/tablet repair. Precision scraper blades, 0.4mm thick, not easily deformed, ensuring efficient solder removal. Suitable for BGA soldering, chip balling, adhesive removal, precision soldering, and electronic repair.

Features:
1. Temperature Recognition Alert Function: Equipped with 4 different temperature indicators (138°C, 150°C, 183°C, 199°C), effectively preventing solder paste mixing and improving work efficiency.
2. Selected Non-Magnetic Steel Material: Utilizing finely finished tin, the scraper's details showcase extremely high quality, preventing the accumulation of metal shavings or debris.
3. Thin yet strong blade: The scraper is only 0.4mm thick, made of spring steel, possessing exceptional toughness and rapid rebound, ensuring it doesn't deform and provides stable operation.
4. Angled blade design: The specially designed angled blade precisely targets IC/CPU holes, enabling efficient solder paste removal.
5. Ultra-hard stainless steel material: The ultra-hard scraper material ensures even solder removal and minimizes solder paste contamination, guaranteeing high-quality completion of delicate tasks.
6. Multi-functional: It can be used for solder removal and prying open solder paste, offering versatility to meet various soldering needs.