2UUL BH17 CPU Reballing Platform with iPhone A10-A19/Android Stencil

2UUL BH17 CPUREBALL BASE Magnetic Dual-sided Reballing Platform with A10-A19 Pro Exynos Qualcomm MTK Hisilicon EMMC RAM Stencil for iPhone 7-17 Pro Max and Android Phone repair. Double-sided solder balls, two thicknesses, with built-in strong magnets, allow for quick and precise CPU installation, ensuring no displacement during soldering. Suitable for repairing various mobile phone CPUs.

Feature:
1. Double-sided solder ball design: Supports two different solder ball sizes simultaneously, suitable for repairing CPUs in both Apple and Android devices.
2. Two thickness options: Offers two solder ball thicknesses: T0.6 (for Apple devices) and T0.35 (for Android devices), meeting the soldering requirements of different CPU models.
3. Strong magnets: Built-in strong magnets ensure stable CPU fixation and prevent displacement during soldering.
4. Precision Soldering: Provides a precise soldering platform, ensuring even distribution of solder balls and perfect CPU alignment.
5. Wide Applicability: Particularly suitable for multiple mainstream mobile phone CPU models such as the SM8750 Snapdragon 8 Ultra, A19 Pro, and A19.
6. Compact and Convenient: Compact design, suitable for use by repair personnel in limited spaces, easy to carry and store.