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50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm
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50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm

50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm

High purity rosin core solder wire for mobile phone electronic components welding repair, 50g 0.3/0.5/0.8/1.0mm rosin soldering wire for phone BGA motherboard repair, No-cleaning melt rosin core solder welding flux 2.0% iron soldering wire for mobile phone electronic components welding repair.

PHONEFIX 50g Solder Wire 2% Flux / High Purity Rosin Core / Low Melting Point for Phone Wiring Repair

Specification :
  • Materials: Tin and lead
  • Weight: 50g
  • Wire Diameter: 0.3/0.5/0.8/1.0mm
  • Flux Content: 2.0(%)
  • Melting Point: about 290(°C)
  • Type: Rosin Core Solder Wire
  • Shape: Small roll type
  • Uses: electronic components Welding repair
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From $0.12

Original: $0.35

-66%
50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm—

$0.35

$0.12

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50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm - Image 3
50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm - Image 4
50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm - Image 5
50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm - Image 6
50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm - Image 7
50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm - Image 8
50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm - Image 9
50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm - Image 10

50g High Purity Rosin Solder Wire Core No Cleaning Wire 0.3 0.5 0.8mm

High purity rosin core solder wire for mobile phone electronic components welding repair, 50g 0.3/0.5/0.8/1.0mm rosin soldering wire for phone BGA motherboard repair, No-cleaning melt rosin core solder welding flux 2.0% iron soldering wire for mobile phone electronic components welding repair.

PHONEFIX 50g Solder Wire 2% Flux / High Purity Rosin Core / Low Melting Point for Phone Wiring Repair

Specification :
  • Materials: Tin and lead
  • Weight: 50g
  • Wire Diameter: 0.3/0.5/0.8/1.0mm
  • Flux Content: 2.0(%)
  • Melting Point: about 290(°C)
  • Type: Rosin Core Solder Wire
  • Shape: Small roll type
  • Uses: electronic components Welding repair

Product Information

Shipping & Returns

Description

High purity rosin core solder wire for mobile phone electronic components welding repair, 50g 0.3/0.5/0.8/1.0mm rosin soldering wire for phone BGA motherboard repair, No-cleaning melt rosin core solder welding flux 2.0% iron soldering wire for mobile phone electronic components welding repair.

PHONEFIX 50g Solder Wire 2% Flux / High Purity Rosin Core / Low Melting Point for Phone Wiring Repair

Specification :
  • Materials: Tin and lead
  • Weight: 50g
  • Wire Diameter: 0.3/0.5/0.8/1.0mm
  • Flux Content: 2.0(%)
  • Melting Point: about 290(°C)
  • Type: Rosin Core Solder Wire
  • Shape: Small roll type
  • Uses: electronic components Welding repair

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