MECHANIC Sn63% Pb37% Rosin Core Tin Solder Wire For Phone BGA Repair

MECHANIC HX-T100 55G fine Solder Wire 183℃ Pb37% Sn63% Tin Content High Purity Tin Wire for Mobile Phone Repair. Good solderability, insulation resistance, no spatter and no corrosion, low melting point and high brightness solder joint. Suitable for mobile phone motherboard BGA chips repair and electronics circuit board soldering repair.

Parameter:
Model: MECHANIC HX-T100 fine Solder Wire.
Size: 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.8mm.1.0mm, 1.2mm.
Weight: 55G 
Melting point: 183°C
Tin(Sn): 63%
Lead(Pb): 37%
Flux: 1.0-3.0%
CI(Flux): <0.1%
Expansion: 75%

Features: 
1. It has a low melting point and is often used for soldering irons for repairing mobile phone circuit boards. The solder joints are bright and full.
2. It has antioxidant stability and corrosion resistance, and has excellent desoldering performance.
3. It is widely used in the field of electronics and electrical, and can be used to weld mobile phone motherboards, electronic equipment and other components.
4. It has less residue, bright solder joints, and reliable performance.
5. It has good welding performance and low corrosion.
6. There is less spatter, no smoke, and fresh smell during welding.
7. It is easy to carry and is an essential tool for mobile phone repair.