Amaoe BGA Reballing Stencil For Huawei CPU HU:1-4

AMAOE BGA reballing stencil 0.12mm HU:1 HU:2 HU:3 HU:4 for Huawei HI HiSilicon CPU series soldering repair. Amaoe BGA reballing stencil Huawei CPU tin planting steel mesh for Huawei CPU chip tin planting soldering repair.

Option:
HU:1: For Huawei HI3650 HI3660 HI3630.
HU:2: For Huawei HI6250 HI3660 HI6220.
HU:3: For Huawei HI6260 V100, HI3670, HI3680, HI6260 V101, HI3670/80.
HU:4: For Huawei HI6290/L V1, HI3690 5G, HI3690 CPU, HI6280, HI9500 V1, HI3690 RAM.

Features:
1. Brand New.
2. BGA stencil for reballing pins For Huaiwei CPU RAM IC

Advantage:
1. Deformation resistant material.
2. Precise pins locatioN.
3. Square round hole.
4. Good material.