Amaoe 0.12MM Universal CPU BGA Reballing Stencil For Samsung 

Amaoe 0.12MM BGA reballing stencil UBGA Planting Tin Stencis for Samsung U-SMG1 U-SMG2 U-SMG3 U-SMG4 U-SMG5, U-SMU1 U-SMU2 U-SMU3.  Amaoe universal 0.12MM BGA reballing stencil steel mesh for Samsung CPU IC chips soldering repair.

Option:
U-SMG1: for exynos8895/7570/7580/3475.
U-SMG2: for exynos9610/9611/7904/7885.
U-SMG3: for exynos9820/9810/850/3830.
U-SMG4: for exynos880/980/1080/1280.
U-SMG5: for exynos990/2100/2200/E9925.
U-SMU1: for exynos8895-1703/3475/3470/7870/7880/7570/7580, exynos8895 RAM.
U-SMU2: for exynos9610/9611/9609/850/3830/7884/7885/7904/880/980/1280/E8825, exynos10/9611 RAM, exyson7884/7885/7904 RAM.
U-SMU3: for exynos2100/9815/1080/9820/9810/2200/E9925, RAM 496/556.