Amaoe BGA Reballing Stencil For HI6250 HI3690 CPU 5G
AMAOE For CPU RAM HI6250 HI6260 V101 HI3650 HI3660 HI3690 4G 5G HI3680 HI3670 BGA Reballing Stencil IC CHIP Template.
HI3690 4G 5G CPU HI3690/3680/3670 RAM BGA Stencil Reballing IC Pin Solder Tin Plant Net Heating Template 0.12mm Thickness.
Option:
option 1: HI6250
option 2: HI6260 V101
option 3: HI3630/3635 CPU
option 4: HI3650 RAM
option 5: HI3650 CPU
option 6: HI3660 CPU
option 7: HI3660 RAM
option 8: Hi3690/80/70 RAM
option 9: HI3690 CPU 4G
option 10: HI3690 CPU 5G
More Images
Amaoe BGA Reballing Stencil For HI6250 HI3690 CPU 5G
AMAOE For CPU RAM HI6250 HI6260 V101 HI3650 HI3660 HI3690 4G 5G HI3680 HI3670 BGA Reballing Stencil IC CHIP Template.
HI3690 4G 5G CPU HI3690/3680/3670 RAM BGA Stencil Reballing IC Pin Solder Tin Plant Net Heating Template 0.12mm Thickness.
Option:
option 1: HI6250
option 2: HI6260 V101
option 3: HI3630/3635 CPU
option 4: HI3650 RAM
option 5: HI3650 CPU
option 6: HI3660 CPU
option 7: HI3660 RAM
option 8: Hi3690/80/70 RAM
option 9: HI3690 CPU 4G
option 10: HI3690 CPU 5G
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
AMAOE For CPU RAM HI6250 HI6260 V101 HI3650 HI3660 HI3690 4G 5G HI3680 HI3670 BGA Reballing Stencil IC CHIP Template.
HI3690 4G 5G CPU HI3690/3680/3670 RAM BGA Stencil Reballing IC Pin Solder Tin Plant Net Heating Template 0.12mm Thickness.
Option:
option 1: HI6250
option 2: HI6260 V101
option 3: HI3630/3635 CPU
option 4: HI3650 RAM
option 5: HI3650 CPU
option 6: HI3660 CPU
option 7: HI3660 RAM
option 8: Hi3690/80/70 RAM
option 9: HI3690 CPU 4G
option 10: HI3690 CPU 5G
