Amaoe BGA Reballing Stencil MP1/MAX1/MT1/PM1/PM2/PM3/MT1/MT2

Amaoe MTK MT Power Maxim Max Power Qualcomm PM Power IC BGA Reballing Stencil MP1/MAX1/MT1/PM1/PM2/PM3/MT1/MT2. Amaoe MT1 MT2 BGA Stencil For MTK Power IC MT Chip Solder Ball Reballing Pins Tin Plant Net Square Hole.

Option:
MT:1: MT6350V MT6323LGA MT6329A MT6165V MT6329A MT6169V For MTK MT Power PMIC Chip BGA Stencil IC Solder Reballing Tin.
MP:1: MT6356W MT6357V/CRV MT6358W PM660A/L PM670A/L PM660 PM670 MP6335 PM845 PM540 PMI632 PM640MT6336WPMT6370P MT6371P.

Features:
1. Brand New.
2. BGA stencil for reballing pins for MTK Power IC

Advantage:
1. Deformation resistant material
2. Precise pins locatio
3. Square round hole
4. Good material