Amaoe WXCC1-2 Wireless Device Memory Chips Reballing Stencil
AMAOE WXCC1 0.15MM BGA reballing stencil and WXCC2 0.12MM reballing steel mesh for wireless device memory chips BGA153 BGA56 BGA88 BGA64 OMAPL132E tin planting repair. Amaoe WXCC series tinning steel mesh adopts a heat dissipation hole anti-bulging design.
Option:Â
1. AMAOE WXCC1 0.15MM stencil: for BGA153 BGA56 BGA88 BGA64 OMAPL132E (0.8mm pitch 19x19).
2. AMAOE WXCC2 0.12MM stencil: 0.5mmm pitch 5x6, 0.4mmm pitch 4x4.
Product Parameters:
Model: Amaoe WXCC1, WXCC2
Origin: Mainland China
Color classification: Silver.Â
Original: $2.99
-65%$2.99
$1.05More Images
Amaoe WXCC1-2 Wireless Device Memory Chips Reballing Stencil
AMAOE WXCC1 0.15MM BGA reballing stencil and WXCC2 0.12MM reballing steel mesh for wireless device memory chips BGA153 BGA56 BGA88 BGA64 OMAPL132E tin planting repair. Amaoe WXCC series tinning steel mesh adopts a heat dissipation hole anti-bulging design.
Option:Â
1. AMAOE WXCC1 0.15MM stencil: for BGA153 BGA56 BGA88 BGA64 OMAPL132E (0.8mm pitch 19x19).
2. AMAOE WXCC2 0.12MM stencil: 0.5mmm pitch 5x6, 0.4mmm pitch 4x4.
Product Parameters:
Model: Amaoe WXCC1, WXCC2
Origin: Mainland China
Color classification: Silver.Â
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
AMAOE WXCC1 0.15MM BGA reballing stencil and WXCC2 0.12MM reballing steel mesh for wireless device memory chips BGA153 BGA56 BGA88 BGA64 OMAPL132E tin planting repair. Amaoe WXCC series tinning steel mesh adopts a heat dissipation hole anti-bulging design.
Option:Â
1. AMAOE WXCC1 0.15MM stencil: for BGA153 BGA56 BGA88 BGA64 OMAPL132E (0.8mm pitch 19x19).
2. AMAOE WXCC2 0.12MM stencil: 0.5mmm pitch 5x6, 0.4mmm pitch 4x4.
Product Parameters:
Model: Amaoe WXCC1, WXCC2
Origin: Mainland China
Color classification: Silver.Â
