🎉 Up to 70% Off Selected ItemsShop Sale
MECHANIC iBGA 13 Reballing Stencil Platform For iPhone 13 Pro Max Mini
MECHANIC iBGA 13 Middle Layer Motherboard Reballing Kit For iPhone 13 mini pro max Template Soldering Platform With Stencil, 4 in 1 BGA Reballing Stencil Platform Motherboard Middle Rework Tin Mesh Template for iPhone 13/13 Pro/13 Pro Max/ 12 mini.
Features:
1. Anti-leakage tin barrier design.
2. High temperature does not allow the drum.
3. Strong magnetic automatic positioning, precision positioning.
4. Integrated, removable tin planting.
5. Positioning slot of the double-sided motherboard.
6. For iPhone 13/13mini/13 Pro/13 Pro Max.
Features:
1. Anti-leakage tin barrier design.
2. High temperature does not allow the drum.
3. Strong magnetic automatic positioning, precision positioning.
4. Integrated, removable tin planting.
5. Positioning slot of the double-sided motherboard.
6. For iPhone 13/13mini/13 Pro/13 Pro Max.
$4.90
Original: $13.99
-65%MECHANIC iBGA 13 Reballing Stencil Platform For iPhone 13 Pro Max Mini—
$13.99
$4.90More Images
MECHANIC iBGA 13 Reballing Stencil Platform For iPhone 13 Pro Max Mini
MECHANIC iBGA 13 Middle Layer Motherboard Reballing Kit For iPhone 13 mini pro max Template Soldering Platform With Stencil, 4 in 1 BGA Reballing Stencil Platform Motherboard Middle Rework Tin Mesh Template for iPhone 13/13 Pro/13 Pro Max/ 12 mini.
Features:
1. Anti-leakage tin barrier design.
2. High temperature does not allow the drum.
3. Strong magnetic automatic positioning, precision positioning.
4. Integrated, removable tin planting.
5. Positioning slot of the double-sided motherboard.
6. For iPhone 13/13mini/13 Pro/13 Pro Max.
Features:
1. Anti-leakage tin barrier design.
2. High temperature does not allow the drum.
3. Strong magnetic automatic positioning, precision positioning.
4. Integrated, removable tin planting.
5. Positioning slot of the double-sided motherboard.
6. For iPhone 13/13mini/13 Pro/13 Pro Max.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
MECHANIC iBGA 13 Middle Layer Motherboard Reballing Kit For iPhone 13 mini pro max Template Soldering Platform With Stencil, 4 in 1 BGA Reballing Stencil Platform Motherboard Middle Rework Tin Mesh Template for iPhone 13/13 Pro/13 Pro Max/ 12 mini.
Features:
1. Anti-leakage tin barrier design.
2. High temperature does not allow the drum.
3. Strong magnetic automatic positioning, precision positioning.
4. Integrated, removable tin planting.
5. Positioning slot of the double-sided motherboard.
6. For iPhone 13/13mini/13 Pro/13 Pro Max.
Features:
1. Anti-leakage tin barrier design.
2. High temperature does not allow the drum.
3. Strong magnetic automatic positioning, precision positioning.
4. Integrated, removable tin planting.
5. Positioning slot of the double-sided motherboard.
6. For iPhone 13/13mini/13 Pro/13 Pro Max.
