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Mechanic MagTin Tin Planting Platform For iPhone Huawei Qualcomm
Mechanic Mag Tin chip tin planting platform for iPhone Android. Mechanic magnetic levitation chip tin planting platform with stencil for iPhone Huawei Qualcomm IC CPU Nand flash fonts reballing soldering. MECHANIC Mag Tin positioning Tin Planting reballing steel mesh for iPhone Android Phone Chip iPhone series/ Huawei series/ Qualcomm series.
Option:
1. Standard set: MagTin positioning platform + iPhone A8-A15 CPU stencil(8pcs).
2. Qualcomm series stencil only(7pcs).
3. Huawei series stencil only(8pcs).
Features:
1. Strong Magnetic: According to the principle of magnetic levitation.
2. Automatically adsorbed and clamped the steel stencils.
3. Infinite Update: For all BGA chip tin planting, constantly updated.
4. Steel Stencils Set: iPhone series, Huawei series, Qualcomm series.
5. Premium Imported: High temperature resistance of 500°C no deformation or bulging 6. Made of AAAA grade steel, good flexibility.
7. Magnetic Module: Fix the chip in the upper left corner of the chip groove.
8. Make the magnetic module withstand the edge of the chip automatically. It can cover the corresponding chip stencil.
Support model:
1. iPhone A8/A9/A10/A11/A12/A13/A14/A15 CPU.
2. Qualcomm Snapdragon 865 large/888/855/845/765G/865 small/778
3. Huawei Hisilicon 960-HI 3660/985/820-HI 6290/L/970-HI 3670/9000-HI 3610/810-HI 6280/710-HI 6260/990-3690 5G/980-HI 3680.
Option:
1. Standard set: MagTin positioning platform + iPhone A8-A15 CPU stencil(8pcs).
2. Qualcomm series stencil only(7pcs).
3. Huawei series stencil only(8pcs).
Features:
1. Strong Magnetic: According to the principle of magnetic levitation.
2. Automatically adsorbed and clamped the steel stencils.
3. Infinite Update: For all BGA chip tin planting, constantly updated.
4. Steel Stencils Set: iPhone series, Huawei series, Qualcomm series.
5. Premium Imported: High temperature resistance of 500°C no deformation or bulging 6. Made of AAAA grade steel, good flexibility.
7. Magnetic Module: Fix the chip in the upper left corner of the chip groove.
8. Make the magnetic module withstand the edge of the chip automatically. It can cover the corresponding chip stencil.
Support model:
1. iPhone A8/A9/A10/A11/A12/A13/A14/A15 CPU.
2. Qualcomm Snapdragon 865 large/888/855/845/765G/865 small/778
3. Huawei Hisilicon 960-HI 3660/985/820-HI 6290/L/970-HI 3670/9000-HI 3610/810-HI 6280/710-HI 6260/990-3690 5G/980-HI 3680.
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From $1.33
Original: $3.79
-65%Mechanic MagTin Tin Planting Platform For iPhone Huawei Qualcomm—
$3.79
$1.33More Images
Mechanic MagTin Tin Planting Platform For iPhone Huawei Qualcomm
Mechanic Mag Tin chip tin planting platform for iPhone Android. Mechanic magnetic levitation chip tin planting platform with stencil for iPhone Huawei Qualcomm IC CPU Nand flash fonts reballing soldering. MECHANIC Mag Tin positioning Tin Planting reballing steel mesh for iPhone Android Phone Chip iPhone series/ Huawei series/ Qualcomm series.
Option:
1. Standard set: MagTin positioning platform + iPhone A8-A15 CPU stencil(8pcs).
2. Qualcomm series stencil only(7pcs).
3. Huawei series stencil only(8pcs).
Features:
1. Strong Magnetic: According to the principle of magnetic levitation.
2. Automatically adsorbed and clamped the steel stencils.
3. Infinite Update: For all BGA chip tin planting, constantly updated.
4. Steel Stencils Set: iPhone series, Huawei series, Qualcomm series.
5. Premium Imported: High temperature resistance of 500°C no deformation or bulging 6. Made of AAAA grade steel, good flexibility.
7. Magnetic Module: Fix the chip in the upper left corner of the chip groove.
8. Make the magnetic module withstand the edge of the chip automatically. It can cover the corresponding chip stencil.
Support model:
1. iPhone A8/A9/A10/A11/A12/A13/A14/A15 CPU.
2. Qualcomm Snapdragon 865 large/888/855/845/765G/865 small/778
3. Huawei Hisilicon 960-HI 3660/985/820-HI 6290/L/970-HI 3670/9000-HI 3610/810-HI 6280/710-HI 6260/990-3690 5G/980-HI 3680.
Option:
1. Standard set: MagTin positioning platform + iPhone A8-A15 CPU stencil(8pcs).
2. Qualcomm series stencil only(7pcs).
3. Huawei series stencil only(8pcs).
Features:
1. Strong Magnetic: According to the principle of magnetic levitation.
2. Automatically adsorbed and clamped the steel stencils.
3. Infinite Update: For all BGA chip tin planting, constantly updated.
4. Steel Stencils Set: iPhone series, Huawei series, Qualcomm series.
5. Premium Imported: High temperature resistance of 500°C no deformation or bulging 6. Made of AAAA grade steel, good flexibility.
7. Magnetic Module: Fix the chip in the upper left corner of the chip groove.
8. Make the magnetic module withstand the edge of the chip automatically. It can cover the corresponding chip stencil.
Support model:
1. iPhone A8/A9/A10/A11/A12/A13/A14/A15 CPU.
2. Qualcomm Snapdragon 865 large/888/855/845/765G/865 small/778
3. Huawei Hisilicon 960-HI 3660/985/820-HI 6290/L/970-HI 3670/9000-HI 3610/810-HI 6280/710-HI 6260/990-3690 5G/980-HI 3680.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Mechanic Mag Tin chip tin planting platform for iPhone Android. Mechanic magnetic levitation chip tin planting platform with stencil for iPhone Huawei Qualcomm IC CPU Nand flash fonts reballing soldering. MECHANIC Mag Tin positioning Tin Planting reballing steel mesh for iPhone Android Phone Chip iPhone series/ Huawei series/ Qualcomm series.
Option:
1. Standard set: MagTin positioning platform + iPhone A8-A15 CPU stencil(8pcs).
2. Qualcomm series stencil only(7pcs).
3. Huawei series stencil only(8pcs).
Features:
1. Strong Magnetic: According to the principle of magnetic levitation.
2. Automatically adsorbed and clamped the steel stencils.
3. Infinite Update: For all BGA chip tin planting, constantly updated.
4. Steel Stencils Set: iPhone series, Huawei series, Qualcomm series.
5. Premium Imported: High temperature resistance of 500°C no deformation or bulging 6. Made of AAAA grade steel, good flexibility.
7. Magnetic Module: Fix the chip in the upper left corner of the chip groove.
8. Make the magnetic module withstand the edge of the chip automatically. It can cover the corresponding chip stencil.
Support model:
1. iPhone A8/A9/A10/A11/A12/A13/A14/A15 CPU.
2. Qualcomm Snapdragon 865 large/888/855/845/765G/865 small/778
3. Huawei Hisilicon 960-HI 3660/985/820-HI 6290/L/970-HI 3670/9000-HI 3610/810-HI 6280/710-HI 6260/990-3690 5G/980-HI 3680.
Option:
1. Standard set: MagTin positioning platform + iPhone A8-A15 CPU stencil(8pcs).
2. Qualcomm series stencil only(7pcs).
3. Huawei series stencil only(8pcs).
Features:
1. Strong Magnetic: According to the principle of magnetic levitation.
2. Automatically adsorbed and clamped the steel stencils.
3. Infinite Update: For all BGA chip tin planting, constantly updated.
4. Steel Stencils Set: iPhone series, Huawei series, Qualcomm series.
5. Premium Imported: High temperature resistance of 500°C no deformation or bulging 6. Made of AAAA grade steel, good flexibility.
7. Magnetic Module: Fix the chip in the upper left corner of the chip groove.
8. Make the magnetic module withstand the edge of the chip automatically. It can cover the corresponding chip stencil.
Support model:
1. iPhone A8/A9/A10/A11/A12/A13/A14/A15 CPU.
2. Qualcomm Snapdragon 865 large/888/855/845/765G/865 small/778
3. Huawei Hisilicon 960-HI 3660/985/820-HI 6290/L/970-HI 3670/9000-HI 3610/810-HI 6280/710-HI 6260/990-3690 5G/980-HI 3680.
