MIJING R11 R12 Degumming Fixture for BGA IC Soldering/Glue Removal
MIJING R11 Rotatable Chip Holder and R12 IC Glue Removal Fixture for Mobile Phone Repair and Electronic BGA Soldering Repair. MIJING R11/R12 CPU IC Clamp Soldering Fixture supports chips of various sizes and is suitable for precise fixation during chip desoldering and adhesive removal repair processes.
Features:
1. The MIJING R11 IC Clamp features a rotating open-and-close design that allows for easy handling of black adhesive on chip packages and supports a wide range of chip sizes.
2. The Mijing R12 chip removal fixture offers a large-travel design suitable for securing large chips and mobile phone CPUs—making it particularly ideal for precise immobilization during chip debonding and repair processes.
3. Rotating Open-and-Close Design: The R11 features a rotating mechanism that allows for effortless opening and closing, significantly enhancing operational convenience.
4. Black Adhesive Handling: The R11 is specifically designed to facilitate the removal and management of black adhesive found on chip packages, thereby boosting repair efficiency.
5. Multi-Size Chip Compatibility: The R11 supports various chip specifications, offering broad compatibility across different components.
6. Large-Travel Design: The R12 provides a maximum travel distance of 23.5mm, making it suitable for securing and debonding larger chips.
7. Premium Materials: Both the R11 and R12 are crafted from high-grade materials, ensuring superior quality and long-term durability.
8. Support for Large Chips & Mobile CPUs: The R12 is engineered specifically for large-format chips and the majority of mobile phone CPUs, enabling it to handle more complex repair tasks.
Product Specification:
Brand: MIJING
Model: R11 / R12
Dimensions:
· R11: Φ80 x 20mm
· R12: 100 x 72 x 23mm
Weight:
· R11: 200g
· R12: 136.5g
Original: $7.99
-65%$7.99
$2.80More Images
MIJING R11 R12 Degumming Fixture for BGA IC Soldering/Glue Removal
MIJING R11 Rotatable Chip Holder and R12 IC Glue Removal Fixture for Mobile Phone Repair and Electronic BGA Soldering Repair. MIJING R11/R12 CPU IC Clamp Soldering Fixture supports chips of various sizes and is suitable for precise fixation during chip desoldering and adhesive removal repair processes.
Features:
1. The MIJING R11 IC Clamp features a rotating open-and-close design that allows for easy handling of black adhesive on chip packages and supports a wide range of chip sizes.
2. The Mijing R12 chip removal fixture offers a large-travel design suitable for securing large chips and mobile phone CPUs—making it particularly ideal for precise immobilization during chip debonding and repair processes.
3. Rotating Open-and-Close Design: The R11 features a rotating mechanism that allows for effortless opening and closing, significantly enhancing operational convenience.
4. Black Adhesive Handling: The R11 is specifically designed to facilitate the removal and management of black adhesive found on chip packages, thereby boosting repair efficiency.
5. Multi-Size Chip Compatibility: The R11 supports various chip specifications, offering broad compatibility across different components.
6. Large-Travel Design: The R12 provides a maximum travel distance of 23.5mm, making it suitable for securing and debonding larger chips.
7. Premium Materials: Both the R11 and R12 are crafted from high-grade materials, ensuring superior quality and long-term durability.
8. Support for Large Chips & Mobile CPUs: The R12 is engineered specifically for large-format chips and the majority of mobile phone CPUs, enabling it to handle more complex repair tasks.
Product Specification:
Brand: MIJING
Model: R11 / R12
Dimensions:
· R11: Φ80 x 20mm
· R12: 100 x 72 x 23mm
Weight:
· R11: 200g
· R12: 136.5g
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
MIJING R11 Rotatable Chip Holder and R12 IC Glue Removal Fixture for Mobile Phone Repair and Electronic BGA Soldering Repair. MIJING R11/R12 CPU IC Clamp Soldering Fixture supports chips of various sizes and is suitable for precise fixation during chip desoldering and adhesive removal repair processes.
Features:
1. The MIJING R11 IC Clamp features a rotating open-and-close design that allows for easy handling of black adhesive on chip packages and supports a wide range of chip sizes.
2. The Mijing R12 chip removal fixture offers a large-travel design suitable for securing large chips and mobile phone CPUs—making it particularly ideal for precise immobilization during chip debonding and repair processes.
3. Rotating Open-and-Close Design: The R11 features a rotating mechanism that allows for effortless opening and closing, significantly enhancing operational convenience.
4. Black Adhesive Handling: The R11 is specifically designed to facilitate the removal and management of black adhesive found on chip packages, thereby boosting repair efficiency.
5. Multi-Size Chip Compatibility: The R11 supports various chip specifications, offering broad compatibility across different components.
6. Large-Travel Design: The R12 provides a maximum travel distance of 23.5mm, making it suitable for securing and debonding larger chips.
7. Premium Materials: Both the R11 and R12 are crafted from high-grade materials, ensuring superior quality and long-term durability.
8. Support for Large Chips & Mobile CPUs: The R12 is engineered specifically for large-format chips and the majority of mobile phone CPUs, enabling it to handle more complex repair tasks.
Product Specification:
Brand: MIJING
Model: R11 / R12
Dimensions:
· R11: Φ80 x 20mm
· R12: 100 x 72 x 23mm
Weight:
· R11: 200g
· R12: 136.5g
