MJ Z21 MAX CPU Reballing Stencil For iPhone 6-16 Pro Max Repair
MIJING Z21 MAX CPU reballing stencil platform for iPhone A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 Pro CPU Android Huawei Qualcomm, ect. MJ Z21 MAX iPhone/Android CPU chip tin-planting steel mesh for iPhone 6-16 Pro Max Android Phones CPU repair.
Features:
- High-temperature resistance and abrasion resistance
- Imported alloy steel, metal fatigue resistance, make the product use more durable
- Imported alloy steel, high material, and technology, dirt-resistant, easy to clean.
- High precision, Precise alignment Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints
- The square holes and rounded corners are planted with tin and black nets to make each of your tin balls more rounded and fuller.
- Rigid and flexible, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
- High precision, no burrs, so that every mesh can be of the same size and not stuck
- Double magnet, super magnetic, accurate positioning without shaking
Applicable Model:
1. For iPhone 6-16 Pro Max CPU (A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 Pro CPU).
2. For Huawei HI3670, Huawei HI3680, HiSilicon HI3690, HiSilicon HI3690 5G, HiSilicon HI6290/L, SM8250-102 small, SM8250-202 large, Qualcomm SM8350/Snapdragon 888, Snapdragon 845/SDM845, Snapdragon 855/SM8150, Kirin 9000 HI36A0, EMMC/EMCP/UFS BGA153, SM8350/8450, Exynos9610/9611RAM, SM8475, HI6280, SM7250, SM7325, HI6260 V100, HI6260 V101, SM8650, MT6989W.
Original: $0.99
-65%$0.99
$0.35More Images
MJ Z21 MAX CPU Reballing Stencil For iPhone 6-16 Pro Max Repair
MIJING Z21 MAX CPU reballing stencil platform for iPhone A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 Pro CPU Android Huawei Qualcomm, ect. MJ Z21 MAX iPhone/Android CPU chip tin-planting steel mesh for iPhone 6-16 Pro Max Android Phones CPU repair.
Features:
- High-temperature resistance and abrasion resistance
- Imported alloy steel, metal fatigue resistance, make the product use more durable
- Imported alloy steel, high material, and technology, dirt-resistant, easy to clean.
- High precision, Precise alignment Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints
- The square holes and rounded corners are planted with tin and black nets to make each of your tin balls more rounded and fuller.
- Rigid and flexible, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
- High precision, no burrs, so that every mesh can be of the same size and not stuck
- Double magnet, super magnetic, accurate positioning without shaking
Applicable Model:
1. For iPhone 6-16 Pro Max CPU (A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 Pro CPU).
2. For Huawei HI3670, Huawei HI3680, HiSilicon HI3690, HiSilicon HI3690 5G, HiSilicon HI6290/L, SM8250-102 small, SM8250-202 large, Qualcomm SM8350/Snapdragon 888, Snapdragon 845/SDM845, Snapdragon 855/SM8150, Kirin 9000 HI36A0, EMMC/EMCP/UFS BGA153, SM8350/8450, Exynos9610/9611RAM, SM8475, HI6280, SM7250, SM7325, HI6260 V100, HI6260 V101, SM8650, MT6989W.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
MIJING Z21 MAX CPU reballing stencil platform for iPhone A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 Pro CPU Android Huawei Qualcomm, ect. MJ Z21 MAX iPhone/Android CPU chip tin-planting steel mesh for iPhone 6-16 Pro Max Android Phones CPU repair.
Features:
- High-temperature resistance and abrasion resistance
- Imported alloy steel, metal fatigue resistance, make the product use more durable
- Imported alloy steel, high material, and technology, dirt-resistant, easy to clean.
- High precision, Precise alignment Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints
- The square holes and rounded corners are planted with tin and black nets to make each of your tin balls more rounded and fuller.
- Rigid and flexible, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
- High precision, no burrs, so that every mesh can be of the same size and not stuck
- Double magnet, super magnetic, accurate positioning without shaking
Applicable Model:
1. For iPhone 6-16 Pro Max CPU (A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 Pro CPU).
2. For Huawei HI3670, Huawei HI3680, HiSilicon HI3690, HiSilicon HI3690 5G, HiSilicon HI6290/L, SM8250-102 small, SM8250-202 large, Qualcomm SM8350/Snapdragon 888, Snapdragon 845/SDM845, Snapdragon 855/SM8150, Kirin 9000 HI36A0, EMMC/EMCP/UFS BGA153, SM8350/8450, Exynos9610/9611RAM, SM8475, HI6280, SM7250, SM7325, HI6260 V100, HI6260 V101, SM8650, MT6989W.
