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RELIFE RL-044 Precision BGA Reballing Stencil For iPhone 7-13 Pro Max
RELIFE RL-044 Precision BGA Stencils For iPhone 7-13 Series Motherboard repair, 0.12MM Stencils Rapid Heat Dissipation Suitable for iP7ļ½IP13 CPU/ Baseband/ WI-FI/ NFC/ BGA.
Features:
1.Pioneering half etching process, let some components fit into the groove Protect components to avoid burns.
2.Cooling hole patented design, rapid heat dissipation to avoid damage to components due to excessive temperature.
3.Ultra-precise round square hole positioning,precision of hole,Round square hole design,Easy to take off the steel,Make the operation more smooth.
4.Double blister packagingļ¼hard paper package ,protect the steel mesh from being crushed and deformed during transportation.
Features:
1.Pioneering half etching process, let some components fit into the groove Protect components to avoid burns.
2.Cooling hole patented design, rapid heat dissipation to avoid damage to components due to excessive temperature.
3.Ultra-precise round square hole positioning,precision of hole,Round square hole design,Easy to take off the steel,Make the operation more smooth.
4.Double blister packagingļ¼hard paper package ,protect the steel mesh from being crushed and deformed during transportation.
$0.73
Original: $2.09
-65%RELIFE RL-044 Precision BGA Reballing Stencil For iPhone 7-13 Pro Maxā
$2.09
$0.73More Images
RELIFE RL-044 Precision BGA Reballing Stencil For iPhone 7-13 Pro Max
RELIFE RL-044 Precision BGA Stencils For iPhone 7-13 Series Motherboard repair, 0.12MM Stencils Rapid Heat Dissipation Suitable for iP7ļ½IP13 CPU/ Baseband/ WI-FI/ NFC/ BGA.
Features:
1.Pioneering half etching process, let some components fit into the groove Protect components to avoid burns.
2.Cooling hole patented design, rapid heat dissipation to avoid damage to components due to excessive temperature.
3.Ultra-precise round square hole positioning,precision of hole,Round square hole design,Easy to take off the steel,Make the operation more smooth.
4.Double blister packagingļ¼hard paper package ,protect the steel mesh from being crushed and deformed during transportation.
Features:
1.Pioneering half etching process, let some components fit into the groove Protect components to avoid burns.
2.Cooling hole patented design, rapid heat dissipation to avoid damage to components due to excessive temperature.
3.Ultra-precise round square hole positioning,precision of hole,Round square hole design,Easy to take off the steel,Make the operation more smooth.
4.Double blister packagingļ¼hard paper package ,protect the steel mesh from being crushed and deformed during transportation.
Product Information
Product Information
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Description
RELIFE RL-044 Precision BGA Stencils For iPhone 7-13 Series Motherboard repair, 0.12MM Stencils Rapid Heat Dissipation Suitable for iP7ļ½IP13 CPU/ Baseband/ WI-FI/ NFC/ BGA.
Features:
1.Pioneering half etching process, let some components fit into the groove Protect components to avoid burns.
2.Cooling hole patented design, rapid heat dissipation to avoid damage to components due to excessive temperature.
3.Ultra-precise round square hole positioning,precision of hole,Round square hole design,Easy to take off the steel,Make the operation more smooth.
4.Double blister packagingļ¼hard paper package ,protect the steel mesh from being crushed and deformed during transportation.
Features:
1.Pioneering half etching process, let some components fit into the groove Protect components to avoid burns.
2.Cooling hole patented design, rapid heat dissipation to avoid damage to components due to excessive temperature.
3.Ultra-precise round square hole positioning,precision of hole,Round square hole design,Easy to take off the steel,Make the operation more smooth.
4.Double blister packagingļ¼hard paper package ,protect the steel mesh from being crushed and deformed during transportation.
