YCS M.Y M1 M2 M3 M4 Reballing Stencil Platform for MacBook Repair
Option:
YCS M.Y M1 stencil 0.15mm.
YCS M.Y M2 stencil 0.15mm.
YCS M.Y M3 stencil 0.15mm.
YCS M.Y M4 stencil 0.15mm.
M.Y M1, M2, M3, M4, A1706 positioning mold.
YCS M.Y magnetic base.
Features:
1. Magnetic Reinforcement Design: The magnetic platform stabilizes the chip position, providing higher operational precision.
2. High-Strength Steel Mesh: Utilizes a high-temperature resistant steel mesh, enhancing the platform's durability and stability.
3. Multiple Specifications: Offers various models and configurations to meet different equipment needs and repair scenarios.
4. Wide Applicability: Suitable for BGA chip repair of MacBook series products and other electronic equipment.
Original: $1.99
-65%$1.99
$0.70More Images
YCS M.Y M1 M2 M3 M4 Reballing Stencil Platform for MacBook Repair
Option:
YCS M.Y M1 stencil 0.15mm.
YCS M.Y M2 stencil 0.15mm.
YCS M.Y M3 stencil 0.15mm.
YCS M.Y M4 stencil 0.15mm.
M.Y M1, M2, M3, M4, A1706 positioning mold.
YCS M.Y magnetic base.
Features:
1. Magnetic Reinforcement Design: The magnetic platform stabilizes the chip position, providing higher operational precision.
2. High-Strength Steel Mesh: Utilizes a high-temperature resistant steel mesh, enhancing the platform's durability and stability.
3. Multiple Specifications: Offers various models and configurations to meet different equipment needs and repair scenarios.
4. Wide Applicability: Suitable for BGA chip repair of MacBook series products and other electronic equipment.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Option:
YCS M.Y M1 stencil 0.15mm.
YCS M.Y M2 stencil 0.15mm.
YCS M.Y M3 stencil 0.15mm.
YCS M.Y M4 stencil 0.15mm.
M.Y M1, M2, M3, M4, A1706 positioning mold.
YCS M.Y magnetic base.
Features:
1. Magnetic Reinforcement Design: The magnetic platform stabilizes the chip position, providing higher operational precision.
2. High-Strength Steel Mesh: Utilizes a high-temperature resistant steel mesh, enhancing the platform's durability and stability.
3. Multiple Specifications: Offers various models and configurations to meet different equipment needs and repair scenarios.
4. Wide Applicability: Suitable for BGA chip repair of MacBook series products and other electronic equipment.
